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Wafer cleaning equipment

A technology for cleaning equipment and wafers, used in cleaning methods and utensils, cleaning methods using liquids, chemical instruments and methods, etc., can solve the problems of inaccurate heating temperature and low safety, and ensure temperature accuracy and efficiency. security, ensure equipment safety, and reduce the effect of multiple risks

Active Publication Date: 2021-01-15
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the embodiment of the present application is to provide a wafer cleaning device to solve the problems of inaccurate heating temperature of the liquid and low safety during the wafer cleaning process

Method used

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Embodiment Construction

[0019] The embodiment of the present application provides a wafer cleaning device, which is used to solve the problems of inaccurate heating temperature of the cleaning liquid and low safety during the wafer cleaning process.

[0020] In order to enable those skilled in the art to better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described The embodiments are only some of the embodiments of the present application, but not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts shall fall within the scope of protection of this application.

[0021] The wafer cleaning equipment provided in the embodiments of this specification can be applied to the wafe...

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Abstract

An embodiment of the invention discloses wafer cleaning equipment. The wafer cleaning equipment comprises a process tank assembly; the process tank assembly comprises a tank body assembly and a safetycontrol circuit; the tank body assembly comprises a tank body and a heater; the tank body is used for bearing a cleaning liquid; the heater is used for heating the cleaning liquid in the tank body; the safety control circuit comprises a first control loop and a second control loop; the first control loop is used for controlling the second control loop to be connected or disconnected; the second control loop is used for controlling the heater to be started or stopped; the first control loop comprises a first control device and a liquid leakage detection assembly which are connected in series;when the control part of the first control device is powered on, the switch part is closed, when the control part is powered off, the switch part is disconnected, and the control part of the first control device is connected in series in the first control loop; the second control loop comprises a second control device; the switch part of the second control device is connected in series in the second control loop; and the control part of the second control device is connected in series with the switch part of the first control device.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a wafer cleaning device. Background technique [0002] The processing and manufacturing of wafers is extremely complicated. It takes hundreds of processes and ensures the high precision of each process to finally obtain a wafer with an availability rate that meets the standard. After each process, there will be different types of residues on the wafer, such as chemicals, metals, glue, particles and other impurities. Each impurity corresponds to a different type of cleaning step, so cleaning plays an important role in the wafer manufacturing process and is also one of the most basic processes. [0003] At present, wafer cleaning equipment mainly involves two types of slot machines and single-chip microcomputers, which are used to clean impurities such as particles, polymers, oxides, metal ions, and redundant films. Among them, the cleaning of particulate impurities occupi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B08B3/08B08B3/10B08B13/00H01L21/67
CPCB08B3/08B08B3/10B08B13/00H01L21/67023
Inventor 徐瑶
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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