Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Wafer Cleaning Equipment

A technology for cleaning equipment and wafers, applied in cleaning methods and utensils, cleaning methods using liquids, chemical instruments and methods, etc. Temperature accuracy and efficiency, the effect of reducing multiple risks

Active Publication Date: 2022-07-19
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
View PDF9 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the embodiment of the present application is to provide a wafer cleaning device to solve the problems of inaccurate heating temperature of the liquid and low safety during the wafer cleaning process

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Wafer Cleaning Equipment
  • Wafer Cleaning Equipment
  • Wafer Cleaning Equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0019] Embodiments of the present application provide a wafer cleaning device, which is used to solve the problems of inaccurate heating temperature of cleaning solution and low safety during wafer cleaning.

[0020] In order to make those skilled in the art better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described The embodiments are only a part of the embodiments of the present application, but not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the scope of protection of this application.

[0021] The wafer cleaning equipment provided in the embodiments of this specification can be applied to the wafer cl...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The embodiment of the present application discloses a wafer cleaning device. The wafer cleaning equipment includes a process tank assembly, and the process tank assembly includes a tank body component and a safety control circuit; the tank body component includes a tank body and a heater, the tank body is used for carrying the cleaning liquid, and the heater is used for heating the cleaning liquid in the tank body ; The safety control circuit includes a first control loop and a second control loop, the first control loop is used to control the conduction or disconnection of the second control loop, and the second control loop is used to control the heater to be turned on or off; wherein, the first control loop The loop includes a first control device and a liquid leakage detection component connected in series; when the control part of the first control device is energized, its switch part is closed, and when the control part is powered off, the switch part is disconnected, and the control part of the first control device is connected in series with the first control part. The second control loop includes a second control device; the switch part of the second control device is connected in series in the second control loop, and the control part of the second control device is connected in series with the switch part of the first control device.

Description

technical field [0001] The present invention relates to the technical field of semiconductors, and in particular, to a wafer cleaning device. Background technique [0002] The processing and manufacturing of wafers is extremely complex. Hundreds of processes are required, and the accuracy of each process is guaranteed to be extremely high, in order to finally obtain a wafer with a satisfactory availability rate. After each process, there are different kinds of residues on the wafer, such as impurities such as chemicals, metals, glues, particles, etc. Each impurity corresponds to a different type of cleaning step, so cleaning plays an important role in the wafer fabrication process and is also one of the most basic processes. [0003] At present, the cleaning equipment of wafers mainly involves two methods: trough machine and single-chip microcomputer, which are used to clean impurities such as particles, polymers, oxides, metal ions and excess films. Among them, the cleani...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): B08B3/08B08B3/10B08B13/00H01L21/67
CPCB08B3/08B08B3/10B08B13/00H01L21/67023
Inventor 徐瑶
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com