Circuit substrate turnover device and method thereof

A technology of circuit substrates and flipping devices, applied in the directions of printed circuits, printed circuit manufacturing, and manufacturing of printed circuit precursors, to achieve the effects of improving efficiency, improving coherence and fluency, and improving stability

Inactive Publication Date: 2021-01-12
朱雷
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The purpose of the present invention is to solve the above-mentioned problem that the existing circuit substrate can only be laminated on one side, and to provide a circuit substrate turning device, which can stably pick up the circuit substrate through the turning suction component, and place it on the turning drive component On the top, the circuit substrate is turned over by 180° by turning over the drive component to realize double-sided lamination and improve lamination efficiency

Method used

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  • Circuit substrate turnover device and method thereof
  • Circuit substrate turnover device and method thereof
  • Circuit substrate turnover device and method thereof

Examples

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Embodiment Construction

[0032] The specific implementation manner of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0033] Such as figure 1As shown, a circuit substrate copper film pressing equipment, the equipment includes a frame and an indexing device 1 on it, a circuit substrate feeding device 2, a first copper film feeding device 3, a first hot pressing device 4, Turning device 5, second copper film feeding device 6, second hot pressing device 7 and hot roll discharging device 8; indexing plate device 1 is provided with a first station 11, a second station 12, a third station Position 13, fourth position 14, fifth position 15, sixth position 16, seventh position 17 and eighth position 18; first position 11, second position 12, third position 13 , the fourth station 14 , the fifth station 15 , the sixth station 16 , the seventh station 17 and the eighth station 18 are all provided with rectangular circuit substrate carriers 19 . The circ...

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PUM

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Abstract

The invention belongs to the technical field of circuit sub-substrate automatic production, and particularly relates to a circuit substrate turnover device which comprises a turnover suction assemblyand a turnover driving assembly. The turnover suction assembly is used for sucking the circuit substrate and placing the circuit substrate on the turnover driving assembly, and the turnover driving assembly is used for turning over the circuit substrate; a turnover horizontal moving electric cylinder is arranged on a rack, a turnover horizontal moving frame is arranged on a moving part of the turnover horizontal moving electric cylinder, a turnover lifting frame is arranged on the turnover horizontal moving frame through a turnover lifting sliding rail, and a turnover lifting spring is arranged at the bottom of the turnover lifting frame; an overturning air cylinder is arranged on the overturning lifting frame, an overturning rotating shaft is connected with a rotating part of the overturning air cylinder, and the overturning rotating shaft penetrates through the overturning lifting frame to be connected with an overturning plate. The circuit substrate turnover device has the advantageof realizing automatic double-sided copper film pressing of the circuit substrate.

Description

technical field [0001] The invention belongs to the technical field of circuit substrate automatic production, and in particular relates to a circuit substrate turning device and a method thereof. Background technique [0002] With the gradual deepening of electronic technology in various application fields, highly integrated circuit boards have become an inevitable trend. Highly integrated package modules require a good heat dissipation carrying system, while traditional circuit boards FR-4 and CEM-3 are in TC (thermal conductivity ) has become a bottleneck restricting the development of electronic technology. The LED industry, which has developed rapidly in recent years, has also put forward higher requirements for the TC index of its load-carrying circuit boards. In the field of high-power LED lighting, materials with good heat dissipation properties such as metal and ceramics are often used to prepare circuit substrates. [0003] The circuit substrate is a thermally co...

Claims

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Application Information

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IPC IPC(8): H05K3/00H05K3/02
CPCH05K3/00H05K3/022H05K2203/068
Inventor 朱雷杜长坤
Owner 朱雷
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