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Method for forming interconnection line

A technology of interconnecting lines and axes, applied in the field of forming interconnecting lines

Active Publication Date: 2020-12-29
SEMICON MFG INT (SHANGHAI) CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the reliability of interconnect lines needs to be improved

Method used

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  • Method for forming interconnection line
  • Method for forming interconnection line
  • Method for forming interconnection line

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Embodiment Construction

[0032] The present invention is described below based on examples, but the present invention is not limited to these examples. In the following detailed description of the invention, some specific details are set forth in detail. The present invention can be fully understood by those skilled in the art without the description of these detailed parts. In order not to obscure the essence of the present invention, well-known methods, procedures, procedures, components and circuits have not been described in detail.

[0033] Additionally, those of ordinary skill in the art will appreciate that the drawings provided herein are for illustrative purposes and are not necessarily drawn to scale.

[0034] Unless the context clearly requires, throughout the specification and claims, "comprises", "comprises" and similar words should be interpreted in an inclusive sense rather than an exclusive or exhaustive meaning; that is, "including but not limited to" meaning. In the description of...

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Abstract

The embodiment of the invention provides a method for forming an interconnection line. In the embodiment of the invention, a first mandrel pattern and a second mandrel pattern with opposite end partsare formed on a semiconductor substrate, and the first mandrel pattern comprises a plurality of basically parallel first mandrel lines and second mandrel lines connected with the end parts of the first mandrel lines; the second mandrel pattern includes a plurality of substantially parallel third mandrel axes and a fourth mandrel axis connecting ends of the third mandrel axes. Since the second coreaxis is formed at an end of the first core axis pattern, the side wall formed on the side wall of the second core axis can isolate the interconnection line formed on the inner side of the side wall from the interconnection line on the outer side of the side wall, and then the moving range of the interconnection line cut-off area can be expanded; meanwhile, as the end parts of the first core axislines are connected by the second core axis lines, the first core axis patterns have no single first core axis line at the end parts, and end parts of the core axis patterns do not retract; reliability of the interconnection line is further ensured.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a method for forming an interconnection line. Background technique [0002] With the continuous development of semiconductor manufacturing technology, the integration level of semiconductor devices is getting higher and higher, and the feature size of semiconductor devices is gradually shrinking. In the manufacturing process of semiconductor devices, it involves the formation process of interconnection lines, and the interconnection lines are used to connect semiconductor structures such as transistors and capacitors in the chip to form circuit structures in the chip. However, the reliability of interconnection needs to be improved. Contents of the invention [0003] In view of this, an embodiment of the present invention provides a method for forming an interconnection line, so as to improve the reliability of a semiconductor device. [0004] The method for forming th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/528H01L21/768H01L27/11529H01L27/11573H10B41/41H10B43/40
CPCH01L23/528H01L23/5283H01L21/76802H01L21/76838H10B41/41H10B43/40
Inventor 韩亮仇圣棻张晓伟
Owner SEMICON MFG INT (SHANGHAI) CORP
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