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Semiconductor process equipment and method for transferring wafers

A process equipment and semiconductor technology, applied in semiconductor/solid-state device manufacturing, metal material coating process, conveyor objects, etc., can solve the problems of cumbersome pallet replacement process, reduce equipment operation efficiency, etc., to improve operation efficiency and service life. The effect of lengthening and simplifying the replacement process

Pending Publication Date: 2020-12-25
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The invention discloses a semiconductor process equipment and a method for transferring wafers, so as to solve the problems that the current semiconductor process equipment has a relatively cumbersome pallet replacement process and reduces the operating efficiency of the equipment

Method used

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  • Semiconductor process equipment and method for transferring wafers
  • Semiconductor process equipment and method for transferring wafers
  • Semiconductor process equipment and method for transferring wafers

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Embodiment Construction

[0037] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with specific embodiments of the present invention and corresponding drawings. Apparently, the described embodiments are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0038] The technical solutions disclosed by various embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0039] Please refer to Figure 1 to Figure 11 , the embodiment of the present invention discloses a semiconductor process equipment, and the disclosed semiconductor process equipment includes a...

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Abstract

The invention discloses semiconductor process equipment and a method for transferring wafers. The semiconductor process equipment comprises a reaction chamber and a loading and unloading chamber, wherein a tray and a supporting piece are arranged in the reaction chamber, the supporting piece is arranged on the bottom wall of the reaction chamber, the tray comprises a first sub-tray and a second sub-tray, the second sub-disc is arranged on the supporting piece, the first sub-tray is annular and is in lap joint with the second sub-tray, an annular groove is formed in the first sub-tray, after the first sub-tray is in lap joint with the second sub-tray, the bottom surface of the annular groove is flush with the top surface of the second sub-tray to form a wafer groove used for bearing a wafer, and the size of the second sub-tray is smaller than that of the wafer; and a first transfer assembly is arranged in the loading and unloading chamber. According to the scheme, the problems that thetray replacement procedure of existing semiconductor process equipment is tedious, and the operation efficiency of the equipment is reduced can be solved.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a semiconductor process equipment and a method for transferring wafers. Background technique [0002] In the existing semiconductor process equipment, the transfer of wafers between the reaction chamber and the loading and unloading chamber is realized based on the transfer mechanism. The transfer mechanism usually includes a tray and a grabbing member. The grabbing member can carry out wafer transfer on the tray The pick-and-place operation and realize the transfer of the wafer. At present, the trays are fixed in a fixed way, and the cavity will be opened for replacement at the end of the service life of the tray. Not only is the operation process more cumbersome, but it will also cause the entire semiconductor equipment to suspend operation and reduce operating efficiency. Contents of the invention [0003] The invention discloses a semiconductor process ...

Claims

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Application Information

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IPC IPC(8): H01L21/673H01L21/677H01L21/67C23C16/458
CPCH01L21/67196H01L21/6719H01L21/67333H01L21/67742H01L21/67766H01L21/67775C23C16/4581
Inventor 刘凯
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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