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Improved curative composition

A technology of curing agent and mixture, applied in the field of curing agent preparation, can solve the problems of thickening and cannot be used as a single-component epoxy resin composition, and achieve the effect of rapid curing

Pending Publication Date: 2020-12-22
HEXCEL COMPOSITES SAS +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Unfortunately these hardeners are very reactive so the problem with mixed solutions of resins and these hardeners is that they show an early onset of cure and cannot be used as a single set that is manufactured at the point of use and then delivered Partition epoxy resin compositions, because these compositions will thicken, gel and cure during transportation or storage

Method used

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  • Improved curative composition
  • Improved curative composition
  • Improved curative composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1 to 5

[0091] The following formulations were prepared.

[0092] Table 3. Formulations of Examples 1 to 5

[0093]

[0094]

[0095] The formulations of Examples 1 to 5 were exposed to a temperature of 150°C, the time to 95% cure and the E'Tg were measured and the results are as follows.

[0096] Table 4. Results of Examples 1 to 5.

[0097]

[0098] The following examples show the effect of curing agent on the combination of time to 95% cure and E'Tg.

Embodiment 3 and 6 to 10

[0100] The following formulations were prepared.

[0101] Table 5. Formulations of Examples 3 and 6 to 10

[0102]

[0103]

[0104] The formulations of Examples 3 and 6 to 10 were exposed to a temperature of 150°C and the time to 95% cure and E'Tg were measured and the results are as follows (Table 6).

[0105] Table 6. Results of Examples 3 and 6 to 10

[0106]

Embodiment 11 to 13

[0108] Finally, the formulations of Examples 11 to 13 below were prepared.

[0109] Table 7. Formulations of Examples 11 to 13

[0110] components Example 11 Example 12 Example 13 SCT150 34.2 20 33.8 XD1000 YDPN638 27.60 GT6071 16.4 16 15.50 Epikote 828 16.4 16 15.50 MY721 15 Phenoxy MX153 19 19.00 Aerosil R202 PAT656 / 83R 1 1 1.00 ADH-J 6.80 6.8 OHFU 6.2 6.2 6.2 U52 UR500 DICY 9.0

[0111] The formulations of Examples 11, 12 and 13 were exposed to a temperature of 150°C, the time to 95% cure and the E'Tg were measured and the results are as follows.

[0112] Table 4. Results of Examples 15 to 17.

[0113] Measurement Example 11 Example 12 Example 13 Time to reach 95% curing (minutes) 2.4 1.9 1.7 E'Tg(°C) 142 140 138

[0114] These examples show that reduced time to 95% cure and in...

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PUM

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Abstract

A curative resin containing at least 50 wt % of an epoxy phenolic resin comprising a mixture of a carboxylic hydrazide and a hydroxy substituted urone.

Description

technical field [0001] The present invention relates to curing agent formulations, in particular to curing agent formulations for curing thermosetting resin formulations, especially formulations comprising epoxy novolac resins. Background technique [0002] Composite materials are prepared in many forms. A fiber layer impregnated with a curable resin matrix formulation is called a prepreg. Molding compounds generally comprise chopped isotropic or quasi-isotropic form of fiber material in combination with a resin matrix formulation. The resin matrix formulation in these materials may be an epoxy novolac, which may be uncured or partially cured. [0003] The resin matrix formulation can be selected from a wide range of polymerizable components and additives. Common polymerizable components include epoxies, polyesters, vinyl esters, polyisocyanates, and phenolic resins. Formulations containing these components are commonly referred to as epoxy resin formulations, polyester ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/68C08G59/40
CPCC08G59/4021C08G59/4035C08G59/686C08G59/245C08J5/24C08J2363/02C08J2363/04
Inventor N·弗奇T·甘格尔伯格
Owner HEXCEL COMPOSITES SAS
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