Miniaturized PCB relay

Abstract

The invention discloses a miniaturized PCB relay. The relay comprises an iron core, an armature, a movable reed, a static spring normally open end and a static spring normally closed end. wherein a root part of a swingable part of the movable contact spring is fixed in one surface of the armature, and the other surface of the armature and the pole surface of the iron core are positioned at a corresponding matching position; a movable contact is arranged at the tail end of the swinging part of the movable contact spring and is respectively matched between the normally open end of the static spring and the normally closed end of the static spring; and in one surface of the armature, a groove is arranged between a fixed position corresponding to the root part of the swinging part of the movable contact spring and the movable contact of the movable contact spring and corresponds to the position of the pole surface of the iron core. According to the relay, the weight of the armature can bereduced on the basis of ensuring the effective magnetic conduction area of the armature so as to avoid the shaking problem generated when the normally open end contact is closed, and the pressure of the normally closed end contact can also be ensured so as to ensure stability of relay parameters.

Description

technical field [0001] The invention relates to the technical field of relays, in particular to a miniaturized PCB relay. Background technique [0002] A PCB relay is a relay for mounting on a PCB (ie, a printed circuit board). Due to the limited mounting space on the PCB, the volume of the PCB relay is usually designed to be small. With the continuous advancement of relay miniaturization, the installation area of ​​PCB relays has become smaller and smaller, and the area of ​​the armature has also become smaller. In order to ensure sufficient product suction, and to ensure the effective magnetic area of ​​the armature, to avoid magnetic saturation , so it is necessary to increase the thickness of the armature. However, when the thickness of the armature increases, the weight of the armature will also increase accordingly. When the weight of the armature increases, the contact kinetic energy between the moving contact and the static contact will increase. When the normally o...

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Problems solved by technology

However, when the thickness of the armature increases, the weight of the armature will also increase accordingly. When the weight of the armature increases and the relay operates, the contact kinetic energy between the moving contact and the static contact increases. , thereby affecting the electrical life of the product

In order to solve the problem of vibration when the product is pulled in, the method adopted in the prior art is to directly flatten the head of the armature to reduce the weight of the armature. The support position will be displaced away from the moving contact, which will cause the pressure of the static spring at the normally closed end to decrease, thus affecting the stability of the relay parameters

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