Surface acoustic wave filter and forming method thereof

Abstract

The invention provides a surface acoustic wave filter and a forming method thereof. When the surface acoustic wave filter is manufactured, a packaging cover plate is bonded on a piezoelectric materiallayer, so that the thinning process can be performed on the piezoelectric material layer under the condition that the packaging cover plate can stably support the piezoelectric material layer, and the low-acoustic-impedance material layer and the high-acoustic-impedance material layer in the Bragg reflection layer can be directly deposited on the thinned piezoelectric material layer. Namely, according to the forming method provided by the invention, the processing technology of the device and the packaging technology of the device are combined with each other, so that the packaged surface acoustic wave filter can be directly prepared, the preparation steps of the device are effectively simplified, the preparation difficulty of the Bragg reflection layer is reduced, and the purpose of simplifying the technology is further achieved.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a surface acoustic wave filter and a forming method thereof. Background technique [0002] The surface acoustic wave filter (surface acoustic wave, SAW) is a solid-state electronic device, which mainly uses the acoustic-electric transducer to complete the signal conversion and processing from electrical signal-acoustic signal-electrical signal on the piezoelectric material layer. At present, based on the stable frequency source function and filtering function of the surface acoustic wave filter, it is widely used. With the continuous development of technology, the requirements for the surface acoustic wave filter are getting higher and higher. Therefore, a high-performance A surface acoustic wave filter (IHP-SAW) is proposed. [0003] Specifically, the high-performance surface acoustic wave filter (IHP-SAW) generally arranges periodically arranged low-acoustic-impedance m...

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Problems solved by technology

[0005] Based on the above content, it can be seen that for the surface acoustic wave filter with a Bragg reflection layer, in the processing technology of its device, it is not only necessary to use a difficult bonding process to form a Bragg reflection layer, which makes the processing technology of the SAW filter difficult. Larger, and the preparation cost becomes higher; and, the existing surface acoustic wave filter formation method needs to perform the processing technology of the device and the packaging process of the device successively, and there are many preparation steps, so it is difficult to improve the production efficiency of the device and reduce the Cost of production

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