Encapsulation structure and encapsulation structure manufacturing method

A packaging structure and adapter board technology, which is applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, semiconductor devices, etc., can solve the problem of difficult to achieve higher density integration of chips, the number of interconnection lines, density and package size Major problems, to achieve the effect of improving integration and multi-functionality, improving multi-functionality, and improving integration

Active Publication Date: 2021-01-01
FOREHOPE ELECTRONICS NINGBO CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

COWOS is mainly aimed at the high-end market, the number, density and package size of interconnection lines are relatively large, and it is difficult to achieve higher density integration of chips

Method used

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  • Encapsulation structure and encapsulation structure manufacturing method
  • Encapsulation structure and encapsulation structure manufacturing method
  • Encapsulation structure and encapsulation structure manufacturing method

Examples

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Embodiment Construction

[0048] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. The components of the embodiments of the invention generally described and illustrated in the figures herein may be arranged and designed in a variety of different configurations.

[0049] Accordingly, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art wi...

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Abstract

Embodiments of the present invention provide a packaging structure and a manufacturing method of the packaging structure, which relate to the technical field of semiconductor packaging. The packaging structure includes a substrate, a chip, and an adapter assembly. The adapter assembly includes at least a first adapter plate and a second adapter plate. The first adapter plate includes a first surface and a second surface that are oppositely arranged. There is a first circuit layer, the second surface is provided with a second circuit layer, the second adapter plate includes a third surface and a fourth surface oppositely arranged, the third surface is provided with a third circuit layer, and the fourth surface is provided with a fourth line layer. The first adapter board is arranged on the substrate and is electrically connected to the substrate; the second adapter board is arranged on the side of the first adapter board away from the substrate, and the chip is arranged on the second adapter board and is connected to the second adapter board. Board electrical connection; a conductive post is provided between the first transfer board and the second transfer board, so that the first circuit layer, the second circuit layer, the third circuit layer and the fourth circuit layer are electrically connected to improve chip integration Spend.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to a packaging structure and a manufacturing method of the packaging structure. Background technique [0002] The existing COWOS (Chip-on-Wafer-on-Substrate) is a 2.5D packaging technology introduced by TSMC, also known as wafer-level packaging. COWOS is mainly aimed at the high-end market. The number, density and packaging size of interconnection lines are relatively large, making it difficult to achieve higher density integration of chips. Contents of the invention [0003] The purpose of the present invention includes, for example, providing a packaging structure and a manufacturing method of the packaging structure, which can realize more wiring, improve chip integration, and increase the multi-functionality of the packaging structure. [0004] Embodiments of the present invention can be realized like this: [0005] In the first aspect, an embodiment of the p...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/31H01L21/56H01L25/07H01L23/498
CPCH01L23/3121H01L21/56H01L25/072H01L23/49838H01L23/49827H01L23/49816H01L2924/181H01L2224/16225H01L2224/97
Inventor 何正鸿钟磊李利
Owner FOREHOPE ELECTRONICS NINGBO CO LTD
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