Efficient water-cooling heat dissipation plate

A high-efficiency technology for water-cooled heat sinks, which can be used in cooling/ventilation/heating transformation, electrical components, and structural parts of electrical equipment. It can solve problems such as poor heat dissipation and inability to ensure uniform heat dissipation, and achieve the effect of improving heat exchange efficiency.

Pending Publication Date: 2020-11-03
ZHEJIANG UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this design cannot guarantee uniform heat dissipation, so the heat dissipation effect is poor

Method used

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  • Efficient water-cooling heat dissipation plate
  • Efficient water-cooling heat dissipation plate
  • Efficient water-cooling heat dissipation plate

Examples

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Embodiment Construction

[0025] The following are specific embodiments of the present invention and in conjunction with the accompanying drawings, further describe the technical solutions of the present invention, but the present invention is not limited to these cases.

[0026] Such as Figure 1-3 As shown, a high-efficiency water-cooled heat dissipation plate includes a water collection tank 1, a water inlet tank 101, a water outlet tank 102, a water outlet tank 201, a water inlet tank 2 202, a water collection tank 2 2, a heat dissipation water channel 3, and a heat dissipation water channel 2 4 , water inlet 5, water outlet 6, semi-cylindrical shell 7 and cover plate 8.

[0027] Water collection tank one 1 comprises water inlet tank one 101 and water outlet tank one 102, water collection tank two 2 comprises water inlet tank two 202 and water outlet tank two 201, the shape of the water inlet and outlet tanks is semi-cylindrical, and the two water tanks on the same side (inlet and outlet tanks) ) ...

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PUM

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Abstract

The invention discloses an efficient water-cooling heat dissipation plate, and the heat dissipation plate comprises a first water collection tank, a second water collection tank, a first heat dissipation water channel and a second heat dissipation water channel, wherein the first water collection tank comprises a first water inlet tank and a first water outlet tank, the second water collection tank comprises a second water inlet tank and a second water outlet tank, and the first water inlet tank and the second water outlet tank are communicated through the first heat dissipation water channel;and the first water outlet groove is communicated with the second water inlet groove through a second heat dissipation water channel. The invention has the beneficial effects that 1) the first heat dissipation water channel and the second heat dissipation water channel are independently and adjacently arranged, and the water flow directions in the first heat dissipation water channel and the second heat dissipation water channel are opposite, so heat dissipation is uniform, and the heat dissipation quality is guaranteed; 2) the heat dissipation water channels are connected in parallel betweenthe water inlet groove and the water outlet groove, and the flow channels are short, so heat can be quickly taken away by heat-exchanged water, and the heat exchange efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of heat dissipation of electronic components, in particular to a high-efficiency water-cooled heat dissipation plate. Background technique [0002] As a mature heat dissipation technology, liquid cooling has been widely used in industrial methods, such as the heat dissipation of automobiles and aircraft engines. The application of liquid cooling technology to the computer field is not because air cooling has reached its end, but because the heat dissipation rate of liquid is much faster than that of air, so liquid cooling radiators often have a good heat dissipation effect, and at the same time, they are also less noisy. can be well controlled. Due to various advantages in heat dissipation efficiency and quietness, liquid cooling also appeared shortly after computer air cooling became popular. The good news is that today, liquid cooling in the computer field is becoming popular. This situation is due to th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20218H05K7/20272
Inventor 刘红陈豪杰高俊涛
Owner ZHEJIANG UNIV OF TECH
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