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Welding method and device for flexible circuit board and printed circuit board

A flexible circuit board and printed circuit board technology, which is applied in the structural connection of printed circuits, printed circuit components, printed circuits, etc., can solve the problems of not being able to arrange devices, increase the layout space of PCB and FPC, and reduce bonding Reinforcing plate steps, reducing the steps of peeling the reinforcing plate, and improving processing efficiency

Pending Publication Date: 2020-10-30
HONOR DEVICE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Similar to the ACF process, due to the need for hot pressing, devices cannot be placed on the corresponding back area of ​​the PCB by hot pressing, and devices cannot be placed on the hot pressing area on the FPC, which increases the layout space of PCB and FPC

Method used

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  • Welding method and device for flexible circuit board and printed circuit board
  • Welding method and device for flexible circuit board and printed circuit board
  • Welding method and device for flexible circuit board and printed circuit board

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Embodiment Construction

[0054] Embodiments of the present application are described below with reference to the drawings in the embodiments of the present application. The terms used in the implementation of the embodiments of the present application are only used to explain the specific embodiments of the present application, and are not intended to limit the present application.

[0055] In order to reduce the layout space occupied by interconnection products between flexible and rigid boards, embodiments of the present application provide a welding method and device for a flexible circuit board and a printed circuit board.

[0056] In this welding method, first, the FPC is hardened, for example, a hard reinforcing plate is glued on the FPC. Then, use surface mount technology (surface mount technology, SMT) to attach the hardened FPC to the PCB similar to surface mount devices (surface mounted devices, SMD). Soldering is then completed by reflow curing. Finally, the reinforcement board is peeled ...

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PUM

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Abstract

The embodiment of the invention provides a welding method and device for a flexible circuit board and a printed circuit board. The welding method comprises the steps of bonding a reinforcing plate onthe flexible circuit board through glue to obtain a surface assembly type device; welding the surface assembly type device on a first circuit board by using a surface assembly technology so as to weldthe flexible circuit board with the first circuit board; and stripping the reinforcing plate and the glue from the surface assembly type device to obtain an interconnection device of the flexible circuit board and the first circuit board. By implementing the embodiment of the invention, the layout space occupied by the interconnection product between the soft board and the hard board can be reduced.

Description

technical field [0001] The present application relates to the field of electronic technology, in particular to a welding method and device for a flexible circuit board and a printed circuit board. Background technique [0002] At present, electronic devices such as mobile phones and tablets continue to develop. In these electronic devices, printed circuit boards (printed circuit board, PCB) and flexible printed circuit boards (flexible printed circuit, FPC) are widely used. The FPC on board (FOB) technology can realize the soldering of FPC and PCB together. At present, the interconnection technology between flexible and rigid boards may include: board-to-board connector (board to board, BTB) scheme, anisotropic conductive film (anisotropic conductive film, ACF) process and hot-press soldering process (hotbar). [0003] In the BTB scheme, a BTB is welded on the FPC and the PCB respectively, and the FPC and the PCB are interconnected through the mechanical fastening of the t...

Claims

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Application Information

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IPC IPC(8): H05K3/36H05K1/14
CPCH05K1/147H05K3/363H05K1/14H05K3/36
Inventor 杨俊杰杨迎喜汪志强何丽荣江帆李文婧邓凌超刘鹏
Owner HONOR DEVICE CO LTD
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