Packaging mechanism for pressure sensor chip packaging test, and packaging method thereof

Abstract

The invention discloses a packaging mechanism for a pressure sensor chip packaging test, and a packaging method thereof. According to the packaging mechanism, two injection molding pieces are arrangedon the surface of a cover plate; the d packaging mechanism further comprises a first linkage part, a second linkage part and a third linkage part; through the injection molding pieces, under the action of the first linkage part, a sensor chip is driven to be electrically connected with PCB; through the injection molding pieces, under the combined action of the first linkage part and the second linage part, the cover plate and a substrate are driven to be fixedly connected; and through the injection molding pieces, under the combined action of the first linkage part and the third linage part,a copper nut and the PCB are driven to be fixedly connected. According to the invention, by pulling two limiting columns upwards, a pressure sensor chip can be packaged, so that the packaging is convenient and fast; and a silica gel can be injected into a cover plate through an injection molding channel to fill the periphery of a sensor chip, so that the sealing protection effect on the sensor chip is achieved, and it is guaranteed that the inner cavity of the cover plate can be filled with the silica gel.

Description

technical field [0001] The invention relates to the technical field of chip packaging, in particular to a packaging mechanism and a packaging method for pressure sensor chip packaging and testing. Background technique [0002] The pressure sensor senses the pressure signal through the pressure sensitive unit, and can convert the pressure signal into an available output electrical signal according to certain rules, and then processed by the signal processing unit into the corresponding analog output or digital output form. [0003] For example, the pressure sensor medium isolation packaging structure disclosed in the reference document Chinese patent CN201310123972.5, publication date: 20141015, the reference document includes a tube base, a tube cap, a pressure sensor chip, a substrate and a fluid tube. The tube base is provided with a through hole and fixed on the Above the substrate, the pressure sensor chip is pasted on the tube base and covers the through hole. The press...

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Problems solved by technology

[0004] However, although this reference document omits other media isolation technologies such as a series of complicated processes such as oil filling, and has a more compact structure, it needs The electrical connection between the sensor chip and the PCB board, the fixed connection between the PCB board and the tube base, and the fixed connection between the cover plate and the tube base are performed in sequence. The packaging process is cumbersome, and after filling the silicone gel around the sensor chip, then When the cover plate and the tube base are fixedly connected, there is a gap between the silicone gel and the cover plate, which makes the silicone gel easy to shake, which in turn affects the sensor chip wrapped by the silicone gel

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