A laser cutting structure for high-tech material processing

A material processing and laser cutting technology, used in laser welding equipment, metal processing equipment, welding/cutting auxiliary equipment, etc., can solve the problems of dust generation, environmental pollution, waste, etc., to achieve convenient adjustment, avoid air pollution, and achieve reciprocation The effect of using

Active Publication Date: 2021-12-17
苏州鼎芯光电科技有限公司 +1
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0004] However, there are the following disadvantages in the process of laser cutting: dust is generated during the cutting process, and the traditional open type is easy to cause dust to escape and cause environmental pollution;
[0005] When cutting, high-speed nitrogen flow is used to blow off the molten material, and the recovery of nitrogen flow is poor, resulting in waste

Method used

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  • A laser cutting structure for high-tech material processing
  • A laser cutting structure for high-tech material processing
  • A laser cutting structure for high-tech material processing

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Embodiment Construction

[0026] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention.

[0027] In describing the present invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", " The orientation or positional relationship indicated by "outside", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, so as to Specific orientation configurations and operations, therefore, are not to be construed as limitations on the invention.

[0028] refer to Figure ...

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PUM

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Abstract

The invention discloses a laser cutting structure for processing high-tech materials, which comprises a processing groove and a horizontal plate. A connecting pipe, the connecting pipe is inserted with a connecting rod, the outer wall of one end of the connecting rod far away from the connecting pipe is provided with a lifting plate, and the end of the connecting rod is fixed to the inner bottom wall of the connecting pipe A telescopic spring is connected, a wedge-shaped plate is sleeved on the outer wall of one end of the horizontal plate, the lower end of the lifting plate is in contact with the upper side wall of the wedge-shaped plate, and a telescopic rod is arranged on one side of the processing tank. The movement of the driving end of the telescopic rod in the present invention realizes the closure of the cover plate when the workpiece is clamped and cut, and stops the clamped cover plate after the workpiece is cut to facilitate the work, and extracts the gas inside the processing tank to filter the dust, avoiding air pollution and realizing The reciprocating utilization of nitrogen.

Description

technical field [0001] The invention relates to the technical field of high-tech material processing, in particular to a laser cutting structure for high-tech material processing. Background technique [0002] High-tech materials are new materials that can make breakthroughs in new environments and new fields, and can be innovative in use. From aviation to our daily life, there are shadows of high-tech materials. [0003] In order to ensure the cutting quality in the processing of high-tech materials, laser cutting is generally used to process materials. Laser cutting uses focused high-power density laser beams to irradiate workpieces, so that the irradiated materials are rapidly melted, vaporized, ablated or reached At the same time, the molten material is blown away by the high-speed airflow coaxial with the beam, so as to realize the cutting of the workpiece. [0004] However, there are the following disadvantages in the process of laser cutting: dust is generated during...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/38B23K26/70B23K37/04B23K26/142B23K26/08
CPCB23K26/38B23K26/702B23K37/0435B23K26/142B23K26/0884
Inventor 魏文军
Owner 苏州鼎芯光电科技有限公司
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