Eureka AIR delivers breakthrough ideas for toughest innovation challenges, trusted by R&D personnel around the world.

Wafer film pasting machine

A laminating machine and laminating technology, which is used in electrical components, semiconductor/solid-state device manufacturing, circuits, etc.

Pending Publication Date: 2020-10-02
东莞思沃智能装备有限公司
View PDF0 Cites 10 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of this application is to provide a wafer laminating machine, which aims to solve the problem in the prior art that in the production process of wafers and other products, it is necessary to perform film lamination processing on the product and cut off the dry film outside the product boundary

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Wafer film pasting machine
  • Wafer film pasting machine
  • Wafer film pasting machine

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0045] In order to make the purpose, technical solution and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present application, and are not intended to limit the present application.

[0046] It should be noted that when an element is referred to as being “fixed” or “disposed on” another element, it may be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0047] It is to be understood that the terms "length", "width", "top", "bottom", "front", "rear", "left", "right", "vertical", "horizontal", "top" , "bottom", "inner", "outer" and other indicated orientations or posi...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a wafer film pasting machine which comprises a workbench, a film pasting table, a film pressing device, a pressed film sliding and driving mechanism, a film stripping device, astripped film sliding and driving mechanism, a film placing device, a film winding device, a feeding device and a film cutting device. The feeding device conveys a wafer to the film pasting table, the film placing device conveys a protective film to the position above the film pressing table, the pressed film sliding and driving mechanism drives the film pressing device to slide to the position above the film pasting table, and the film pressing device presses the protective film to the surface of the wafer, so that the protective film is attached to the wafer; then, the film cutting device acts to cut the protective film at the edge of the wafer and cut the protective film which is not bonded with the wafer to form a waste film, and at the moment, the waste film is bonded to any exposedposition of the film pasting table; and then the film stripping device clamps the waste film, in the process that the stripped film sliding and driving mechanism drives the film stripping device to move, the waste film is pulled away from the film pasting table, the film stripping device releases the clamping to the waste film, and the film winding device winds the waste film, so that the film pasting operation is completed.

Description

technical field [0001] The present application relates to the field of film attaching equipment, in particular to a wafer film attaching machine. Background technique [0002] Wafer refers to the silicon wafer used in the production of silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer; it can be processed into various circuit element structures on the silicon wafer, and becomes an integrated circuit with specific electrical functions. circuit products. In the production process of wafers and other products, it is necessary to apply film to the product and cut off the dry film outside the product boundary. Contents of the invention [0003] The purpose of this application is to provide a wafer laminating machine, which aims to solve the problem in the prior art that in the production process of wafers and other products, it is necessary to process the product with film and cut off the dry film outside the product boundary. [0...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67
CPCH01L21/67126
Inventor 程彦张成宣胡丽兰
Owner 东莞思沃智能装备有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com