an automatic loading machine

Abstract

The invention belongs to the technical field of wafer loading, and provides an automatic wafer loading machine, which comprises a rack, wherein a wafer frame is arranged at one end of the rack, a first wafer positioning mechanism is arranged on the wafer frame, a wafer loading mechanical arm is arranged in the middle of the rack, a positioning table is further arranged on the rack, a plurality ofsecond wafer positioning mechanisms are arranged on the positioning table, a wafer overturning mechanism is arranged between the positioning table and the wafer frame, a wafer shooting hole is formedin the rack, a shooting mechanism corresponding to the wafer shooting hole is installed on the rack, positioning supporting plates are slidably mounted on the two sides of the wafer loading mechanicalarm correspondingly, a carrier basket is arranged at the other end of the rack, inserting rods are mounted at the ends, close to the carrier basket, of the positioning supporting plates, and a carrier lifting mechanism, a tray cover taking mechanism, an automatic screw feeding mechanism and a screw supply device are further sequentially arranged on the rack in the sliding direction of the positioning supporting plate. According to the invention, accurate and automatic wafer loading can be realized, the wafer loading efficiency is greatly improved, and the wafer quality and the qualification rate in the wafer loading process are effectively ensured not to be influenced.

Description

technical field [0001] The invention relates to the technical field of wafer loading, in particular to an automatic wafer loading machine. Background technique [0002] Wafer refers to the silicon wafer used to make silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer. In the process of wafer production and processing, according to the requirements of the processing technology, ICP etching processing of the wafer is required. Before the ICP etching process, the wafers usually need to be arranged and placed in the tray. This process is called wafer loading. , so that during the etching process, the entire tray carrying the wafer is put into the plasma etching machine for etching process. [0003] At present, the loading operation of wafers in the tray is usually done manually. The manual loading operation is not only labor-intensive, but also has low loading efficiency. Precisely place the wafer into the wafer placement slot of the ...

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Problems solved by technology

[0005] Specifically, the technical problem to be solved by the present invention is to provide an automatic wafer loading machine to solve the problems of high labor intensity, low loading efficiency, easy scratching of wafers and affecting wafer quality in manual wafer loading. technical problem

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