Film laying system for copper-clad laminate combination equipment and copper-clad laminate combination equipment comprising same

Abstract

The invention provides a film laying system for copper-clad laminate combination equipment and the copper-clad laminate combination equipment comprising the same. The film laying system involves a film supply mechanism, a film laying mechanism and a film pressing mechanism, wherein the film laying mechanism is arranged between the film supply mechanism and the film pressing mechanism, and the filmlaying mechanism comprises a driving assembly, a film clamping assembly, a film cutting assembly and a film laying assembly; and the film clamping assembly clamps a film provided by the film supply mechanism, under the driving of the driving assembly, the film is conveyed to the film pressing mechanism to be pressed at a film head of the film, the film clamping assembly loosens the film and retreats to the position behind the film cutting assembly, the film laying assembly presses the film downwards, the film laying mechanism retreats to a preset position, and the film cutting assembly cuts off the film. The film laying system for the copper-clad laminate combination equipment and the copper-clad laminate combination equipment comprising the same have the advantages that the film laying effect is good, the performance is stable, the detection qualification rate of final products is high, configuration of operators is reduced, uncontrollable factors of operation specifications are avoided, the automation degree is high, the traditional manual film laying mode in the industry is changed, and the production efficiency is improved.

Description

technical field [0001] The invention relates to copper-clad laminate processing equipment, in particular to a film-laying system of copper-clad laminate assembly equipment and the copper-clad laminate assembly equipment. Background technique [0002] In the CCL industry, when making copper-clad laminates, they must first be stacked, that is, after laminating various materials for making copper-clad laminates, such as copper foil and adhesive layers, and then laying a layer of copper plates, they enter the lamination process. Most of the existing stacking methods are purely manual methods, which have the problems of low efficiency and unstable quality. There are a small number of factories that use semi-mechanical processing, gantry type, and multi-station processing. This kind of equipment is not only huge, but also can only make adhesive parts with a certain thickness, and the products made are in terms of impedance, viscosity and thickness. Quality requirements cannot be ...

AI Technical Summary

Problems solved by technology

Most of the existing stacking methods are purely manual methods, which have the problems of low efficiency and unstable quality

There are a small number of factories that use semi-mechanical processing, gantry type, and multi-station processing. This kind of equipment is not only huge, but also can only make adhesive parts with a certain thickness, and the products made are in terms of impedance, viscosity and thickness. Can not guarantee the quality requirements

Images