Lifting floating frame device for electroplating equipment

Abstract

The invention discloses a lifting floating frame device for electroplating equipment. The lifting floating frame comprises a frame, a lifting mechanism and a guiding mechanism; the guiding mechanism is located in an electroplating tank, and comprises an upper guiding frame and a lower guiding frame that are arranged along the same vertical axis; the upper guiding frame is fixedly mounted on the frame; the lower guiding frame is mounted at the bottom of the lifting mechanism, can move in the vertical direction under the action of the lifting mechanism, and comprises two symmetrical lower guideplates; a lower guide rail is arranged in a gap between the two lower guide plates; the bottom end of the lower guide plate is provided with an inner cathode baffle and an outer cathode baffle relative to the inner and outer sides of the lower guide rail; a bottom cathode baffle is arranged at the bottom end of the inner cathode baffle; and two ends of the bottom cathode baffle are hermetically connected with the outer cathode baffle.

Description

technical field [0001] The invention belongs to the technical field of electroplating equipment, and in particular relates to a lifting and floating frame device for electroplating equipment. Background technique [0002] Electroplating is the process of plating a thin layer of other metals or alloys on the surface of certain metals using the principle of electrolysis. It is a process of using electrolysis to attach a layer of metal film to the surface of metal or other material parts to prevent metal oxidation. Improve wear resistance, electrical conductivity, reflective properties, corrosion resistance and improve appearance. [0003] Traditional electroplating equipment will place cathode baffles and anode baffles in the electroplating tank to avoid the problem of excessive current at the end of the electroplating substrate, but the cathode baffles and anode baffles of existing electroplating equipment are fixed and cannot According to the height and size of the electrop...

AI Technical Summary

Problems solved by technology

Most of the existing substrate guiding devices are fixed, and in order to adapt to the up and down movement of the cathode baffle and the anode baffle at the lower end of the lifting frame, the substrate guiding device is only arranged on the upper part of the electroplating tank, and the lower end of the guiding device has no Extending to the bottom of the electroplating tank, in such an arrangement, when the height of the electroplating substrate is large, and the cathode baffle and the anode baffle move downward, the electroplating substrate below the substrate guiding device loses the role of the guiding device , there will still be problems such as scratches, deformation, and wrinkles, which will affect the final plating effect and produce defective products

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