Eureka AIR delivers breakthrough ideas for toughest innovation challenges, trusted by R&D personnel around the world.

Multi-ultrathin-chip packaging equipment

A technology for packaging equipment and ultra-thin chips, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the inconvenience of processing and taking multi-ultra-thin chip packaging equipment, reduce the processing efficiency of multi-ultra-thin chip packaging equipment, Reduce the practicality of multi-ultra-thin chip packaging equipment, and achieve the effects of easy implementation and maintenance, simple and reasonable structure, and convenient adjustment

Inactive Publication Date: 2020-09-18
窦晓梅
View PDF0 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a multi-ultra-thin chip packaging device, which has the advantages of convenient adjustment, and solves the problem that the existing multi-ultra-thin chip packaging device cannot rotate the angle and height of the chip during the chip packaging process. The disadvantage of adjustment has caused the disadvantages that the existing multi-ultra-thin chip packaging equipment is inconvenient to process and take during actual use, which is not conducive to the use of users, reduces the processing efficiency of multi-ultra-thin chip packaging equipment, and causes many problems. The disadvantage of low production efficiency of ultra-thin chip packaging equipment reduces the practicability of multi-ultra-thin chip packaging equipment

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Multi-ultrathin-chip packaging equipment
  • Multi-ultrathin-chip packaging equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] Embodiment one: refer to as figure 1 Shown: a multi-ultra-thin chip packaging equipment, including a chip processing device body 1, the four corners of the bottom of the chip processing device body 1 are fixedly connected with a base 9, the shape of the base 9 is circular, and the bottom of the base 9 is provided with anti-skid lines , through the setting of the base 9, the frictional force between the chip processing device body 1 and the ground is increased, and the stability of the chip processing device body 1 is improved. The top of the chip processing device body 1 is provided with a housing 2, and the shell The diameter of the body 2 is not less than ten centimeters, the depth of the shell 2 is not less than fifteen centimeters, and the top of the rotating plate 5 is movably connected with a processing plate 6

[0022] Refer to as figure 2 As shown: the bottom of the inner cavity of the housing 2 is fixedly connected with the motor one 3, and the output shaft o...

Embodiment 2

[0024]The present invention provides a technical solution: a multi-ultra-thin chip packaging equipment, including a chip processing device body 1, the four corners of the bottom of the chip processing device body 1 are fixedly connected with a base 9, the shape of the base 9 is circular, and the base 9 The bottom is provided with anti-slip lines. Through the setting of the base 9, the frictional force between the chip processing device body 1 and the ground is increased, and the stability of the chip processing device body 1 is improved. The top of the chip processing device body 1 is provided with Housing 2, the diameter of housing 2 is not less than ten centimeters, the depth of housing 2 is not less than fifteen centimeters, the bottom of the inner cavity of housing 2 is fixedly connected with motor one 3, and the output shaft of motor one 3 is fixedly connected with a lifting structure 4. The top of the lifting structure 4 penetrates into the inner cavity of the chip proces...

Embodiment 3

[0026] The present invention provides a technical solution: a multi-ultra-thin chip packaging equipment, including a chip processing device body 1, a housing 2 is arranged on the top of the chip processing device body 1, and a motor 3 is welded on the bottom of the inner cavity of the housing 2, The output shaft of the motor one 3 is welded with a lifting structure 4, the top of the lifting structure 4 penetrates into the inner cavity of the chip processing device body 1 and is welded with a rotating plate 5, the top of the rotating plate 5 is movably connected with a processing plate 6, and the bottom of the rotating plate 5 The left side of the motor box 7 is welded with a motor box 7, and the bottom of the motor box 7 inner cavity is welded with a motor two 8, and the output shaft of the motor two 8 runs through to the top of the rotating plate 5 and is welded with the processing plate 6.

[0027] In the present invention: the lifting structure 4 includes a fixed pipe 41 wel...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses multi-ultrathin-chip packaging equipment which comprises a chip processing device body, a shell is arranged at the top of the chip processing device body, and a first motor isfixedly connected to the bottom of an inner cavity of the shell. The first motor drives a lifting structure to rotate; meanwhile, an electric lifting rod is arranged in the lifting structure; a rotating plate and a processing plate are driven to lift by a support rod; after processing, a second motor drives the processing plate to rotate; a user can conveniently take and use the chip processed atthe top of the processing plate, and secondary processing by the user is facilitated. The multi-ultrathin-chip packaging equipment has the advantages of being convenient to adjust, simple and reasonable in structure, easy to achieve and maintain and suitable for batch production in the actual using process, the processing efficiency of the multi-ultrathin-chip packaging equipment is improved, themulti-ultrathin-chip packaging equipment can be conveniently used by the user, and the practicability of the multi-ultrathin-chip packaging equipment is improved.

Description

technical field [0001] The invention relates to the technical field of chip packaging, in particular to a multi-ultra-thin chip packaging device. Background technique [0002] The shell used to install the semiconductor integrated circuit chip plays the role of placing, fixing, sealing, protecting the chip and enhancing the electrothermal performance, and it is also a bridge to communicate the internal world of the chip with the external circuit - the contacts on the chip are connected to the packaging shell with wires On the pins, these pins are connected to other devices through the wires on the printed board. Therefore, the package plays an important role for the CPU and other LSI integrated circuits. The so-called package refers to the shell used to install the semiconductor integrated circuit chip. , it not only plays the role of placing, fixing, sealing, protecting the chip and enhancing thermal conductivity, but also a bridge to communicate the internal world of the c...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67
CPCH01L21/67121
Inventor 窦晓梅
Owner 窦晓梅
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com