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Manufacturing method of multilayer circuit board

A technology for multilayer circuit boards and manufacturing methods, which is applied in the fields of multilayer circuit manufacturing, printed circuit manufacturing, and printed circuits, and can solve difficulties in satisfying multilayer board manufacturing, board thickness or plating thickness-to-diameter ratio capacity limitations, and finished board warping Qu and other questions

Active Publication Date: 2020-09-15
SHANGHAI MEADVILLE ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when making multi-layer circuit boards under the original manufacturing method, when the vertical interconnection stack of multi-layer boards is an asymmetric structure, the finished board will have warping problems, which has been difficult to improve
In addition, the production equipment is limited by the thickness of the plate or the thickness-to-diameter ratio of the electroplating, and the equipment is difficult to meet the production of multi-layer boards, such as the situation that it is difficult to press and produce multi-layer boards, etc.

Method used

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  • Manufacturing method of multilayer circuit board
  • Manufacturing method of multilayer circuit board
  • Manufacturing method of multilayer circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] Such as Figure 1 to Figure 9 As shown, the manufacturing method of the multilayer circuit board in this embodiment, this embodiment illustrates that the multilayer circuit board with asymmetric structure can be manufactured using the method of the present invention. First, divide the target multilayer circuit board into two sub-boards, and the two sub-boards are asymmetrical to each other, for example, as figure 1 As shown, the first sub-board 1 is an arbitrary layer interconnection structure, such as figure 2 As shown, the second sub-board 2 is a through-hole interconnection structure. Each of the first sub-board 1 and the second sub-board 2 has a symmetrical structure, and the first sub-board 1 and the second sub-board 2 are respectively manufactured according to conventional methods. The first sub-board 1 has a graphics layer 3 on the side A. The second sub-board 2 has a C-surface graphics layer 5 . The method for making a multilayer circuit board includes cond...

Embodiment 2

[0052] Such as Figure 10 As shown, the manufacturing method of the multilayer circuit board in this embodiment, this embodiment also illustrates that the multilayer circuit board with an asymmetric structure can be manufactured using the method of the present invention. , and two sub-boards with different numbers of layers as an example. First, the target multilayer circuit board is divided into two sub-boards, namely the third sub-board 13 and the fourth sub-board 14, the third sub-board 13 is a 10-layer board with any layer interconnection structure, the thickness is 2mm, and the fourth sub-board 14 It is a 6-layer board with a through-blind hole interconnection structure and a thickness of 0.5mm. The third sub-board 13 has an E-side graphic layer 15 , and the fourth sub-board 14 has an F-side graphic layer 16 . The third sub-board 13 and the fourth sub-board 14 are respectively fabricated using conventional techniques. The conduction and interconnection method of the th...

Embodiment 3

[0062] Such as Figure 11 As shown, in this embodiment, the thickness of the target multilayer circuit board is 6mm as an example, which exceeds the capability of the equipment. Therefore, the target multilayer circuit board is divided into three sub-boards with a thickness of 2 mm that can be produced by the equipment, that is, the fifth sub-board 19 , the sixth sub-board 20 and the seventh sub-board 21 . The fifth sub-board 19 , the sixth sub-board 20 and the seventh sub-board 21 are respectively manufactured by conventional methods. Then, the fifth sub-board 19, the sixth sub-board 20 and the seventh sub-board 21 are conducted and interconnected, and the method for conducting and interconnecting the fifth sub-board 19, the sixth sub-board 20 and the seventh sub-board 21 includes steps:

[0063] Step 1, with reference to embodiment 1, the first adhesive sheet 7, the second adhesive sheet 8 and the isolation layer 10 are sequentially arranged on the L surface graphic layer 2...

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Abstract

The invention discloses a manufacturing method of a multilayer circuit board, which comprises the steps of firstly, dividing a target multilayer circuit board into a plurality of daughter boards, respectively manufacturing the daughter boards, and then conducting and interconnecting any two daughter boards. The conduction and interconnection method of the two daughter boards comprises the steps ofarranging a first bonding layer on a pattern layer of one daughter board, and arranging a second bonding layer on the first bonding layer; manufacturing a via hole in the daughter board, wherein thevia hole longitudinally penetrates through the second bonding layer and the first bonding layer until reaching a via pattern on the pattern layer; filling the via hole with conductive paste; and conducting and combining the daughter board obtained in the step 3 with another daughter board. According to the invention, the warping problem of the multilayer circuit board with the asymmetric structureis solved. In addition, the multi-layer circuit board with the board thickness or the thickness-diameter ratio exceeding the equipment capability can also be manufactured by using the method disclosed by the invention. According to the method, the manufacturing difficulty of high-thickness and high-thickness-diameter-ratio board electroplating is reduced, the process is simplified, and the manufacturing period of the product is shortened.

Description

technical field [0001] The invention relates to a manufacturing method of a multilayer circuit board. Background technique [0002] With the development of electronic products towards miniaturization, high density and multi-function, printed circuit boards are also developing towards the direction of high frequency, high speed and signal transmission integrity. Therefore, the total number of substrate layers is increasing. In this way, any layer interconnection technology has been developed rapidly because of its higher connection density. However, when making multilayer circuit boards under the original manufacturing method, when the longitudinal interconnection stacking structure of the multilayer boards is asymmetrical, warping of the finished board will occur, which has been difficult to improve. In addition, the production equipment is limited by the thickness of the board or the thickness-to-diameter ratio of the electroplating, and the equipment is difficult to meet ...

Claims

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Application Information

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IPC IPC(8): H05K3/46
CPCH05K3/462H05K3/4614H05K2203/061
Inventor 王红月刘涌黄伟陈晓峰谢明樊仁君
Owner SHANGHAI MEADVILLE ELECTRONICS
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