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A manufacturing process of a thermally conductive silicone gasket and a back glue system used therefor

A technology of heat-conducting silica gel and manufacturing process, which is applied in the field of adhesive system, which can solve the problems of low production efficiency and labor-intensive labor, and achieve the effects of improving production efficiency, improving adhesion performance, and protecting health and the environment

Active Publication Date: 2022-02-18
SHENZHEN HFC SHIELDING PRODS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of the above-mentioned related technologies, the inventor believes that the current method of manual brushing requires a lot of manpower and low production efficiency.

Method used

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  • A manufacturing process of a thermally conductive silicone gasket and a back glue system used therefor
  • A manufacturing process of a thermally conductive silicone gasket and a back glue system used therefor
  • A manufacturing process of a thermally conductive silicone gasket and a back glue system used therefor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0052] S1. Pass the raw material of the heat-conducting silicone gasket through a calender to form a sheet-shaped gasket, and then pass through the baking line, that is, pass through the tunnel oven with the temperature set at 130°C, 140°C and 150°C in sequence, and process it in the tunnel oven for 6 minutes, vulcanization Get insulating thermal silicone gaskets;

[0053] S2. Start the corona device, and the heat-conducting silica gel gasket prepared in step S1 is transported to the bottom of the electrode head in the orbital corona device by a conveyor belt. The distance between the electrode head and the treated surface of the heat-conducting silica gel gasket is 2mm, and the speed of the conveyor belt It is 1.5m / min. The orbital corona device applies high-frequency and high-voltage current to the electrode head. The working frequency of the corona device is 25KHZ, the power is 1KW, and the working voltage is 10KV. Corona discharge occurs on the electrode head. The surface ...

Embodiment 2

[0058] S1. Pass the raw material of the heat-conducting silicone gasket through a calender to form a sheet-shaped gasket, and then pass through the baking line, that is, pass through the tunnel oven with the temperature set at 130°C, 140°C and 150°C in sequence, and process it in the tunnel oven for 15 minutes, vulcanization Get insulating thermal silicone gaskets;

[0059] S2. Start the corona device, and the heat-conducting silica gel gasket prepared in step S1 is transported to the bottom of the electrode head in the orbital corona device by a conveyor belt. The distance between the electrode head and the treated surface of the heat-conducting silica gel gasket is 3mm, and the speed of the conveyor belt It is 1.6m / min. The orbital corona device applies high-frequency and high-voltage current to the electrode head. The working frequency of the corona device is 35KHZ, the power is 3KW, and the working voltage is 10KV. Corona discharge occurs on the electrode head. The surface...

Embodiment 3-4 and comparative example 1-2

[0064] Embodiments 3-4 and Comparative Examples 1-2 are different from Embodiment 1 in that the power and conveyor belt speed in Embodiment 1 are changed.

[0065] Examples 1-4 and Comparative Examples 1-2 are samples of the same batch of insulating and heat-conducting silicone gaskets, preforms prepared through step S2 of setting different conditions, and respectively tested Examples 1-4 and The surface tension coefficient (dyne value) of the preform in Comparative Example 1-2.

[0066] The preform surface tension test experiment is as follows: a. Put the cleaned preform flat on the platform; b. Select a group of dyne pens (corona pens) to draw a stroke on the surface of the preform after treatment. Apply basically the same force to the dyne pen, and the length of the ink strips of the dyne strokes on the preform is greater than 4cm; c. Observe that if the pen and ink liquid on the preform does not shrink within 2 to 3 seconds, the preform The processed surface reaches the d...

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Abstract

This application relates to a heat-conducting silica gel gasket and the adhesive system used therefor. The manufacturing process includes the following steps: S1. Prepare an insulating and heat-conducting silica gel gasket by vulcanization; Below the corona part of the corona device, use the corona part to apply a high-frequency high-voltage current to the electrode, and the electrode generates a corona discharge, and the surface of the heat-conducting silicone gasket is subjected to surface-activated corona treatment, and the corona-treated The heat-conducting silicone gasket is a preform; S3. Put the preform before the pressure roller of the gluing line, place the pressure-sensitive tape on the top of the preform, and attach the pressure-sensitive tape to the preform Above; S4. The preform connected with the pressure sensitive adhesive tape passes under the pressing roller, and the pressing roller adheres the pressure sensitive adhesive tape to the preform. The application can greatly improve the production efficiency of the back glue of the heat-conducting silica gel gasket, reduce the labor intensity of manpower, and reduce the production cost.

Description

technical field [0001] The present application relates to the technical field of interface treatment technology, in particular to a manufacturing process of a heat-conducting silicone gasket and an adhesive system used therefor. Background technique [0002] Thermally conductive silicone pads are used to fill the air gap between the heating element and the heat sink or metal base, and can be used to cover very uneven surfaces. The heat is conducted from the heat-generating device to the metal casing or radiator through the heat-conducting silicone gasket, which can improve the efficiency and service life of the heat-generating electronic components. [0003] At present, when the thermally conductive silicone gasket is assembled on the heating device, in order to prevent the position of the thermally conductive silicone gasket from shifting when the radiator or the housing slides relative to each other, it is usually necessary to stick one side of the thermally conductive sil...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J7/25C08J7/12H05K7/20C08L83/04
CPCC09J7/25C08J7/12H05K7/2039C09J2483/006C08J2383/04
Inventor 窦兰月张延白吉拴
Owner SHENZHEN HFC SHIELDING PRODS CO LTD
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