X-ray-based 3D reconstruction on-line detection equipment and 3D reconstruction detection method

Abstract

The invention discloses x-ray-based 3D reconstruction on-line detection equipment, which comprises a material conveying device, and an x-ray emission device and an x-ray receiving device which are respectively arranged below and above the material conveying device, wherein the material conveying device comprises a first translation mechanism, a second translation mechanism which is perpendicular to the first translation mechanism and in driving connection with the first translation mechanism, and a transfer track mechanism which is parallel to the first translation mechanism and in driving connection with the second translation mechanism. The x-ray-based 3D reconstruction on-line detection equipment not only can detect the defects on a material plane but also can detect the defects in a longitudinal direction of materials, the all-directional and dead-angle detection of the materials can be realized, and the detection precision is high. Meanwhile, the invention further provides an x-ray-based 3D reconstruction detection method. Through the method, a 3D image of the material detection can be reconstructed, so that the detection of the defects of the materials in the longitudinal direction is realized, the detection is comprehensive, the detection blind area is reduced, and the all-directional detection of the materials is realized.

Description

technical field [0001] The invention relates to the technical field of x-ray detection, in particular to an x-ray-based 3D reconstruction online detection device and a 3D reconstruction detection method thereof. Background technique [0002] X-ray inspection equipment has a certain degree of penetrability, and can visually see whether there are defects on the surface or inside of the material without destroying the material, so it can be used to detect whether various parts are qualified. Most of the existing x-ray detection equipment has the following deficiencies: [0003] 1) When inspecting circuit boards, only the plane perspective photos of the circuit board can be imaged, and most circuit boards are multi-layer boards, so the existing x-ray inspection equipment cannot detect multiple defects in the longitudinal direction of the circuit board; [0004] 2) For the solder joints on the circuit board, if there are multiple overlapping virtual solder joints in the vertical...

AI Technical Summary

Problems solved by technology

[0003] 1) When inspecting circuit boards, only the plane perspective photos of the circuit board can be imaged, and most circuit boards are multi-layer boards, so the existing x-ray inspection equipment cannot detect multiple defects in the longitudinal direction of the circuit board;

[0004] 2) For the solder joints on the circuit board, if there are multiple overlapping virtual solder joints in the vertical direction, the existing x-ray inspection equipment cannot detect the defect, that is, the application range is relatively limited;

[0005] 3) The degree of automation is not high, a large amount of manual participation is required, the detection cost is high, the detection efficiency is low, and the detection accuracy is not high

Images