Crystal bar constant angle bonding machine and constant angle bonding method thereof

A bonding method and bonding machine technology, which are applied to fine working devices, working accessories, manufacturing tools, etc., can solve the problems of fixed angle between crystal rods and material plates and low bonding accuracy, and achieve the effect of improving accuracy.

Pending Publication Date: 2020-09-11
台州市博信电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to solve the above-mentioned problems existing in the prior art, and propose a crystal rod fixed-angle bonding ma

Method used

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  • Crystal bar constant angle bonding machine and constant angle bonding method thereof
  • Crystal bar constant angle bonding machine and constant angle bonding method thereof
  • Crystal bar constant angle bonding machine and constant angle bonding method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] like figure 1 As shown, the crystal ingot fixed-angle bonding machine includes a workbench 11, a touch screen 15, an X-ray optical path emitting and receiving mechanism, a correction reference vertical plate 5 and a scanning frame 2 for horizontally placing and positioning the material plate 10, The touch screen 15 is arranged on the workbench 11, and the touch screen 15 is preset with a preset value representing a standard angle between the material plate 10 and the ingot and the allowable deviation range after the angle is fixed. The emitting and receiving mechanism of the X-ray optical path includes an X-ray box 12 , a monochromator 13 and a counter tube 14 , and the X-ray box 12 , the monochromator 13 and the counter tube 14 are all arranged on the workbench 11 . A scanning direct-drive motor 1 is fixed on the workbench 11 , and the scan frame 2 is located above the workbench 11 and connected to the rotating shaft of the scan direct-drive motor 1 . The scan direct-d...

Embodiment 2

[0062] The structure of this embodiment is basically the same as that of Embodiment 1, the difference is: Figure 10-11 As shown, the flexible suction cup 7 is fixed on the correction reference vertical plate 5, the flexible suction cup 7 is an organ-shaped suction cup and can expand and contract along the direction perpendicular to the correction reference vertical plate 5, and the vertical cylinder 9 is located on the front side of the correction reference vertical plate 5 And it is connected with the pressing block 9b. After the organ-shaped suction cup sucks the crystal rod, it will shrink backward through the action of inertia, which is equivalent to the organ-shaped suction cup pulling the crystal rod backward, so that the crystal rod can be attached to the vertical reference plane of the correction reference vertical plate 5 Rely, cooperate with the pressing down of the pressing block 9b, so that the bottom surface of the ingot is attached to the upper surface of the ma...

Embodiment 3

[0074] The crystal rod fixed-angle bonding method is completed by using the crystal rod fixed-angle bonding machine in Embodiment 2, including the following steps:

[0075] A. Feeding: Place the material plate 10 horizontally on the clamp 4a of the scanning frame 2 and tighten the bolts on the clamp 4a so that the material plate 10 is fixed on the clamp 4a, and then place the ingot on the material plate 10, And the side of the ingot is as close as possible to the flexible suction cup 7 on the correction reference vertical plate 5 .

[0076] B. Correcting the fixed angle: click the run button on the touch screen 15, and the ingot fixed-angle bonding machine runs automatically.

[0077] b 1 1. Correct the flexible suction cup 7 on the reference vertical plate 5 to generate vacuum suction to suck the crystal rod. After the flexible suction cup 7 sucks the crystal rod, the corrugated portion will stretch and deform backward due to inertia, which is equivalent to a forward directi...

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Abstract

The invention provides a crystal bar constant angle bonding machine and a constant angle bonding method thereof, belongs to the technical field of semiconductor devices and solves the problem that theconstant angle and the bonding precision of the existing crystal bar and the plate are not high. The crystal bar constant angle bonding machine comprises a working table, an X-ray light path sendingand receiving mechanism and a scanning rack; a correction datum vertical plate is arranged on the scanning rack; a flexible sucking disc is arranged on the correction datum vertical plate; and a pressing block is arranged on the scanning rack. The constant angle bonding method comprises the following steps: A, fixing a plate on the scanning rack and placing a crystal bar on the plate; B, enablingthe flexible sucking disc to adsorb and lean the crystal bar against the correction datum vertical plate, compressing the crystal bar through the pressing block, rotating the scanning rack to treat according to a signal received by the X-ray light path sending and receiving mechanism, obtaining a compensation angle through comparing with a preset value, moving the pressing block upwards, rotatingthe correction datum vertical plate to drive the crystal bar to rotate by the compensation angle through attaching to the upper surface of the plate to finish constant angle; and adopting glue to bondthe crystal bar and the plate.

Description

technical field [0001] The invention belongs to the technical field of semiconductor equipment, and relates to a crystal bar fixed-angle bonding machine and a fixed-angle bonding method thereof. Background technique [0002] A crystal oscillator is an essential component of a digital circuit and provides a clock reference for the digital circuit. The quartz wafer inside the crystal oscillator is made by cutting a crystal rod. Before cutting the ingot, there is a very important fixed-angle bonding process. The specific process is to measure the angle between the outer processing surface of the ingot and the oriented atomic plane through X-ray diffraction, and then bond the ingot to the material with the correct angle posture. board. The purpose of the fixed-angle bonding process is to make the angle between the cut surface and the oriented atomic surface (referred to as the wafer angle) of the cut wafer be within a specified angle range. Chips with different frequencies re...

Claims

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Application Information

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IPC IPC(8): B28D5/00B28D7/00B28D7/04G01N23/20
CPCB28D5/0058B28D5/0064B28D5/0082G01N23/20
Inventor 周晋羽李聪聪周巍
Owner 台州市博信电子有限公司
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