Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Ultrafast laser cutting method and device for transparent materials

A transparent material, ultra-fast laser technology, used in laser welding equipment, welding/welding/cutting items, manufacturing tools, etc., can solve problems such as processing limitations, and achieve the effect of ensuring quality and reliability

Pending Publication Date: 2020-09-04
SUZHOU TUSEN LASER
View PDF0 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] The purpose of the present invention is to provide an ultra-fast laser cutting method for transparent materials, to overcome the problem of limited processing in the prior art, and to improve the precision and speed of laser transparent material processing

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Ultrafast laser cutting method and device for transparent materials
  • Ultrafast laser cutting method and device for transparent materials

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] Example 1: see figure 2 As shown, an ultrafast laser cutting device for transparent materials includes an ultrafast pulse train laser, a light steering component, a Bessel cutting head, and a working platform, and the transparent material to be processed is placed on the working platform.

[0031] like figure 1 As shown, in the ultrafast pulse train laser, the ultrafast pulse train seed laser is composed of a semiconductor laser, a multi-stage or single-stage fiber amplifier and a collimator are arranged, and the semiconductor laser provides a pulse train with a wavelength between 1020 nanometers and 1090 nanometers. The seed laser, after being amplified by the fiber amplifier, enters the collimator and outputs ultrafast pulse train laser. Wherein, each laser pulse train includes at least four laser pulses, the pulse width of each laser pulse is less than 60ps, the peak power of the pulse is greater than 1MW, and the time between adjacent laser pulses in the pulse tra...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
wavelengthaaaaaaaaaa
poweraaaaaaaaaa
wavelengthaaaaaaaaaa
Login to View More

Abstract

The invention discloses an ultrafast laser cutting method and device for transparent materials. Pulse train seed laser is provided by semiconductor laser modulation, after being amplified by an optical fiber amplifier, a laser pulse train is focused to the to-be-processed position of the transparent materials through a Bezier cutting head, three or more focus points are formed in the processed materials, and cutting of the transparent materials is realized by moving the focusing position; At least four laser pulses are included in each laser pulse train, the pulse width is less than 60 ps, thepeak power is greater than 1 mW, and the time between adjacent laser pulses is less than 30 ns; the interval time between adjacent pulse trains is greater than 100 ns; and the laser pulse width broadening amount and the compression amount do not exceed 20% of the seed laser pulse width. The reliability of a cutting light beam is ensured, the waste heat of previous pulse is effectively utilized, the cutting machining quality is ensured, and outline cutting in a straight line shape and various special shapes of the materials is realized.

Description

technical field [0001] The invention relates to a laser processing method, in particular to an ultrafast laser cutting method and a device for cutting transparent materials. Background technique [0002] Glass and sapphire transparent materials have become an indispensable part of people's daily life. With the development of economy, the demand for glass products is increasing day by day. In the production industry of glass and sapphire, glass and sapphire processing is a very important part. [0003] Generally speaking, glass and sapphire processing (cold working) mainly includes polishing, cutting, drilling, engraving, edging, etc. In order to realize the purpose of processing the above-mentioned glass and sapphire industrially, the processing methods used in the prior art mainly include mechanical processing methods, chemical processing methods (mainly used for polishing and etching), and high-pressure water jet processing methods (mainly used for cutting and drilling). ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/38B23K26/402B23K26/0622B23K26/064
CPCB23K26/38B23K26/402B23K26/0622B23K26/064B23K2103/42B23K2103/54B23K2103/56
Inventor 蒋仕彬
Owner SUZHOU TUSEN LASER
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com