Tool bit abrasion monitoring method and tool bit abrasion monitoring system

Abstract

The invention discloses a tool bit abrasion monitoring method, which is used for tool bit abrasion monitoring in a Trim process in a BSI process, and comprises the following steps of: emitting a preset light beam to a tool bit along a first direction on a first side of the tool bit; acquiring an image imaged by the tool bit under the preset light beam on the second side of the tool bit; comparingthe contact side image of the tool bit and the silicon wafer with the unworn side image of the tool bit to obtain the height difference between the contact side tool bit and the unworn side tool bit,and calculating the abrasion loss of the tool bit; wherein the first direction is perpendicular to the tool bit working face, and the first side of the tool bit is the opposite side of the second sideof the tool bit. The invention further discloses a tool bit abrasion monitoring system. According to the invention, the step of cutting off a specific depth at a specific position by using a tool biton a silicon wafer in the prior art can be reduced, so that the silicon wafer does not need to be consumed, frequent maintenance and replacement of machine equipment are not needed, the tool bit abrasion monitoring cost can be reduced, and the production efficiency is improved.

Description

technical field [0001] The invention relates to the field of semiconductor production and manufacturing, in particular to a tool tip wear monitoring method used for monitoring tool tip wear in a Trim process in a BSI process. The invention also relates to a cutter head wear monitoring system used for monitoring the wear of the cutter head in the Trim process in the BSI process. Background technique [0002] Trim is an important process in the BSI process, which is to cut off a circle of a certain depth and width on the edge of the silicon wafer with a knife head. During the Trim operation, the cutter head will be worn, and when the wear reaches a certain level, it needs to be sharpened to regain a flat cutting surface. Therefore, it is necessary to monitor the wear degree of the cutter head at any time during the Trim operation. The current method of monitoring the wear of the cutter head is CCS (Chopper Cut Setup). This method is to use the cutter head to cut a specific d...

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Problems solved by technology

[0007] Because the frequency of CCS measurement is relatively high, the consumption of silicon wafer consumables will be more, and the cost will be higher, and after the silicon wafer is used up, machine PM (equipment maintenance and maintenance) needs to be replaced, which will make the machine PM frequency higher

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