Manufacturing process of low-temperature adhesive for bonding corrugated boards

Abstract

The invention relates to a manufacturing process of a low-temperature adhesive for bonding corrugated boards. The manufacturing process comprises the following steps: firstly, sequentially adding 10-15% of corn starch; 5%-10% of wheat starch; 5%-10% of potato starch and 3%-8% of glutinous rice flour and uniformly mixing; taking out 30% of the mixture, adding 15% of pre-gelatinized starch or pre-gelatinized corn flour, and uniformly mixing; then adding 5%-10% of modified compound protein, 3%-8% of vinyl acetate and 3%-6% of melamine formaldehyde resin; then adding 1%-2% of sodium hydroxide and1%-3% of water-soluble resin; then adding 2%-3% of dry filler, 1%-2% of hot melt resin and 1%-3% of water-soluble resin; adding 5% of the mixture of the hot-melt resin and the light dry filler into the mixture obtained in the third step; and finally, adding the balance of deionized water, and uniformly stirring. The low-temperature adhesive prepared by the process is good in waterproofness, the development requirements of flexibility, corrosion resistance and elasticity of an adhesive film are met, and the quality of a produced product can be improved by 30% in the aspects of physical properties and flatness.

Description

technical field [0001] The invention relates to the field of corrugated cardboard adhesives, in particular to a manufacturing process of a low-temperature adhesive used for bonding corrugated cardboards. Background technique [0002] When producing corrugated paper in the prior art, the adhesive used is to use starch and alkali to undergo a colloidal qualitative change reaction to form a glue with initial tack and reduce the gelatinization temperature. [0003] In view of the advantages of using starch as an adhesive, such as environmental protection, low price, high adhesive performance, and short curing time, this method is used in the corrugated board industry for bonding, but due to natural environmental protection, starch molecules with different components and gelatinization points appear. Structural differences require starch gelatinization with high solid content, high paste volume, high gelatinization temperature and difficult-to-cure formulations. It is difficult t...

AI Technical Summary

Problems solved by technology

[0003] In view of the advantages of using starch as an adhesive, such as environmental protection, low price, high adhesive performance, and short curing time, this method is used in the corrugated board industry for bonding, but starch molecules with different components and gelatinization points appear due to natural environmental protection. Structural differences require starch gelatinization with high solid content, high paste volume, high gelatinization temperature, and difficult-to-cure formulations. It is difficult to stabilize the paste performance. Starch and its derivatives have good adhesion and film-forming properties, which are excellent natural resource adhesives, but its water resistance is poor, and the flexibility, corrosion resistance and elasticity of the film cannot meet the needs of current development