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Optical module

An optical module and optical signal technology, applied in the field of optical communication, can solve problems such as circuit crosstalk, and achieve the effect of solving circuit crosstalk

Active Publication Date: 2020-08-18
HISENSE BROADBAND MULTIMEDIA TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] This application provides an optical module to solve the problem of circuit crosstalk between the transceiver chips on the PCB board of the current optical module due to the short channel wiring distance

Method used

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Embodiment Construction

[0041] In order to enable those skilled in the art to better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described The embodiments are only some of the embodiments of the present application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts shall fall within the scope of protection of this application.

[0042] One of the core links of optical fiber communication is the mutual conversion of optical and electrical signals. Optical fiber communication uses optical signals carrying information to be transmitted in information transmission equipment such as optical fibers / optical waveguides, and the passive transmission characteristics of light i...

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Abstract

The invention discloses an optical module. The optical module comprises a circuit board; a light emitting assembly which is electrically connected with the circuit board and is used for emitting a light signal; a light receiving assembly which is used for receiving a light signal from the outside of the light module; a flexible board which is used for connecting the light receiving assembly and the circuit board; the light receiving assembly comprises a housing; an optical receiving device which is arranged in the shell and is used for receiving an optical signal of an external optical fiber;and a trans-impedance amplifier which is arranged on the surface of the flexible board inserted into the shell, is connected with the light receiving device, is electrically connected with the circuitboard through the flexible board, and is used for transmitting the amplified electric signal to the circuit board. According to the optical module provided by the invention, the optical receiving assembly is integrated on the flexible board; the optical receiving assembly is connected to the circuit board through the flexible board, chips of the transmitting end and the receiving end are prevented from being integrated on the circuit board, the distance between the transmitting chip and the receiving chip is spatially separated through the external flexible board, and the problem of circuit crosstalk is fundamentally solved by means of spatial isolation, position isolation and the like.

Description

technical field [0001] The present application relates to the technical field of optical communication, and in particular to an optical module. Background technique [0002] The optical module is mainly used for photoelectric and electro-optical conversion. Its transmitting end converts electrical signals into optical signals and transmits them through optical fibers, and its receiving end converts received optical signals into electrical signals. Currently, the packaging forms of optical modules mainly include TO (Transistor-Outline, coaxial) packaging and COB (Chip on Board, chip-on-board) packaging. [0003] Among the high-speed optical modules used in existing data centers, the micro-optical COB packaging scheme is mostly used. Usually, the optical modules of the COB scheme are adopted, and the chips of the transmitting end and the receiving end are integrated on the PCB board, and Most of the transceiver chips are integrated on one side of the PCB board, especially for...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04B10/40
CPCH04B10/40
Inventor 张加傲王欣南
Owner HISENSE BROADBAND MULTIMEDIA TECH
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