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A kind of photothermal dual curing polyolefin encapsulating adhesive film and preparation method thereof

An encapsulation film, photothermal curing technology, applied in the direction of film/sheet without carrier, adhesive, photovoltaic power generation, etc., can solve problems such as poor appearance, achieve good appearance, good weather resistance, and reduce the effect of bad appearance

Active Publication Date: 2021-10-08
SUN YAT SEN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to overcome the defects and deficiencies of the existing solar cell encapsulation film, such as air bubbles and degumming, and provide a polyolefin encapsulation film with dual curing of light and heat, using ethylene-octene copolymer, Combined with the mixing of difunctional acrylate monomers and trifunctional acrylic monomers, and the use of photoinitiators and thermal initiators, the photothermal dual-curing polyolefin encapsulation film realizes both light and heat. The polyolefin photovoltaic encapsulation adhesive film is obtained by secondary curing. The curing temperature is low. The polyolefin photovoltaic encapsulation adhesive film has good weather resistance and no air bubbles. It will not degumming after long-term use, which can reduce the appearance of thin-film solar cells.

Method used

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  • A kind of photothermal dual curing polyolefin encapsulating adhesive film and preparation method thereof
  • A kind of photothermal dual curing polyolefin encapsulating adhesive film and preparation method thereof
  • A kind of photothermal dual curing polyolefin encapsulating adhesive film and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] A polyolefin encapsulating adhesive film with photothermal dual curing is prepared from the following components calculated in parts by weight:

[0030] 100 parts of ethylene-octene copolymer;

[0031] 0.5 parts of benzophenone;

[0032] 0.8 parts of tert-butyl peroxycarbonate-2-ethylhexyl;

[0033] 1 part of tripropylene glycol diacrylate;

[0034] 1.5 parts of triisopropyl isocyanurate;

[0035] 0.5 part of vinyltriethoxysilane;

[0036] 0.2 parts of a polymer of succinic acid and 4-hydroxy-2,2,6,6-tetramethyl-1-piperidinol.

[0037] Wherein, the melt index of the ethylene-octene copolymer is 10 g / 10 min.

[0038] The preparation method of the polyolefin encapsulating adhesive film of the above-mentioned photothermal dual curing comprises the following steps:

[0039] S1. Add ethylene-octene copolymer, benzophenone, tert-butyl peroxycarbonate-2-ethylhexyl, tripropylene glycol diacrylate, triisopropyl isocyanurate, vinyl Triethoxysilane and succinic acid are premi...

Embodiment 2

[0043] A polyolefin encapsulating adhesive film with photothermal dual curing is prepared from the following components calculated in parts by weight:

[0044] 100 parts of ethylene-octene copolymer;

[0045] Thiophenyl-p-oxaziridine 1.0 parts;

[0046] 2.0 parts of tert-butyl peroxy 2-ethylhexyl carbonate;

[0047] 1.0 parts of neopentyl glycol diacrylate;

[0048] 0.8 part of triallyl isocyanurate;

[0049] 2.0 parts of vinyltrimethoxysilane;

[0050] 0.3 parts of bis(2,2,6,6-tetramethyl-4-piperidinol) sebacate.

[0051] Wherein, the melt index of ethylene-octene copolymer is 14g / 10min.

[0052] The preparation method of the above photothermal dual-curing polyolefin encapsulating adhesive film is the same as that in Example 1, the difference is that the components in step S1 are replaced, the casting temperature in step S2 is adjusted to 100°C, and the temperature in step S3 is adjusted to a high temperature of 150°C Curing in an autoclave for 12 minutes to prepare a p...

Embodiment 3

[0054] A polyolefin encapsulating adhesive film with photothermal dual curing is prepared from the following components calculated in parts by weight:

[0055] 100 parts of ethylene-octene copolymer;

[0056] 1.3 parts of methyl benzoylformate;

[0057] 1.4 parts of 2-ethylhexyl tert-butylperoxyformate;

[0058] 2.5 parts of dipropylene glycol diacrylate;

[0059] 1.2 parts of 1,3,5-tri-2-propenyl-1,3,5-triazine-2,4,6(1H,3H,5H)-trione;

[0060] 0.7 parts of 3-(methacryloyloxy)propyltrimethoxysilane;

[0061] 0.5 parts of 1-(methyl)-9-(1,2,2,6,6-pentamethyl-4-piperidine) sebacate.

[0062] Wherein, the melt index of the ethylene-octene copolymer is 16 g / 10 min.

[0063] The preparation method of the above photothermal dual-curing polyolefin encapsulation film is the same as that of Example 1, the difference is that the components in step S1 are replaced, the casting temperature in step S2 is adjusted to 90°C, and the temperature in step S3 is adjusted to 155°C. Curing in ...

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Abstract

The invention discloses a photothermal dual-curing polyolefin encapsulation adhesive film, which is prepared from the following components calculated in parts by weight: 100 parts of ethylene-octene copolymer, 0.5-2 parts of photoinitiator, thermal initiator 0.8-2.0 parts, 1-3 parts of difunctional acrylate monomer, 0.5-1.5 parts of trifunctional acrylate monomer, 0.5-2.0 parts of viscosity-enhancing coupling agent, and 0.2-0.6 parts of antioxidant. The invention adopts ethylene-octene copolymer, combined with the compounding of difunctional acrylate monomer and trifunctional acrylic monomer, and at the same time uses photoinitiator and thermal initiator in combination to realize light and thermal double curing. The obtained polyolefin photovoltaic packaging adhesive film has low curing temperature, good weather resistance, no bubbles, no degumming phenomenon after long-term use, and reduces the phenomenon of poor appearance of thin-film solar cells.

Description

technical field [0001] The invention relates to the technical field of solar cell packaging materials, in particular to a photothermal dual-curing polyolefin packaging adhesive film and a preparation method thereof. Background technique [0002] With the rapid development of my country's photovoltaic power generation industry, more and more attention has been paid to subdivided fields represented by solar cells. At present, silicon solar cells account for about 90% of the market share of photovoltaic modules. Under the background that the photovoltaic industry is still dominated by crystalline silicon cells, thin-film solar cells have achieved rapid development by virtue of their own unique advantages. Thin-film technology is considered to be a new generation of solar cell technology. Compared with crystalline silicon cells, thin-film solar cells have the advantages of less material consumption, low energy consumption for preparation, and large space for cost reduction. More...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J4/02C09J4/06C09J11/06C09J7/10C09J7/30H01L31/048
CPCC09J4/06C09J11/06C09J7/10H01L31/0481Y02E10/50
Inventor 郭森阮文红章明秋
Owner SUN YAT SEN UNIV
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