Laser head module of laser lift-off device

Abstract

The laser head module of the laser stripping device is used for selectively melting welding positions of more than one electronic component arranged on a substrate to strip the electronic component from the substrate, and is characterized by comprising an annular shell, a laser head, a laser head and a laser head, an optical lens module which is provided inside the housing and enlarges or reducesa light beam generated from the laser oscillator; a fixing bracket coupled to the outer peripheral surface of the housing; a jig member coupled to the outer peripheral surface of the housing; a blowing unit which is provided on one side of the jig member and blows air toward the electronic component of the substrate; and a suction unit which is provided on the other side of the jig member so as toface the air blowing unit and sucks in the electronic component separated from the substrate by the air blowing unit.

Description

technical field [0001] The present invention relates to a laser lift-off device, and more specifically, to a laser head module of a laser lift-off device capable of removing electronic components melted at soldering sites by laser irradiation without contaminating a substrate. Background technique [0002] In industrial laser processing, micro-laser processing is the field of application with micron (μm)-level precision, and it is widely used in the semiconductor industry, display industry, printed circuit board (PCB) industry, and smartphone industry. In memory chips used in all electronic devices, in order to achieve integration, performance and ultra-high-speed communication speed, technology is developing towards the direction of minimizing the circuit line width and line width spacing. However, at present, only by reducing the circuit line width and line width A wide pitch cannot achieve the required technical level, and is only at the level of stacking a plurality of m...

AI Technical Summary

Problems solved by technology

[0011] Therefore, the overall work time for bonding a plurality of semiconductor chips increases, and there is a problem that the cost of the overall equipment increases rapidly with the addition of a heater head.

[0012] On the other hand, even if a laser head module irradiated with a laser beam is applied to a peeling device instead of the above-mentioned pressure head method, however, at present, workers use a tool to remove electronic components that are separated by laser one by one by hand or use additional jetting. The device is removed, therefore, there is not only the problem of the substrate being contaminated by the heated and molten welding fluid, but also the danger of workers being exposed to safety accidents due to the high heat of the laser head module

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