Polishing head and polishing device

Abstract

The invention provides a polishing head and a polishing device. The polishing head is used for keeping a wafer on a polishing platform. The polishing head comprises a shell and a limiting ring connected to the shell. The limiting ring surrounds the wafer to limit the wafer. The polishing head further comprises a bracket located in the limiting ring. A back film leaning against the surface of the wafer is arranged on the bracket. The bracket is slidably assembled on the shell along a first direction. The polishing head further comprises a driving device which drives the bracket to slide relative to the shell along the first direction. By way of slidably assembling the bracket on the shell along a direction parallel to the axis of the limiting ring and arranging the driving device to drive the bracket to slide along the axis direction of the limiting ring relative to the shell, the bracket can be driven by the driving device to move along a direction far away from the wafer when the limiting ring is relatively worn severely and the separation distance between the bracket and the surface of the wafer is kept in a reasonable range, so that the separation distance between the wafer andthe bracket is not reduced as a result of wear of the limiting ring, and therefore, the edge of the wafer is prevented from being polished excessively.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a polishing head and a polishing device. Background technique [0002] At present, as the patterns designed and produced on the wafer are gradually refined, the CMP (Chemical Mechanical Polishing, chemical mechanical polishing) process is increasing for various purposes. Therefore, the uniformity of the film formation pattern on the wafer in the CMP process becomes more important. The uniformity of the film formation pattern on the wafer in the CMP process is affected by the structure of the equipment, the mode, and the overall process. In order to improve the uniformity of the film pattern on the wafer, various methods such as Membrane Zone Control of the Polishing Head and Pad Conditioning Tuning are used. [0003] A chemical mechanical polishing device (CMP Polisher) is roughly composed of a polishing pad (Polishing Pad), a polishing head (Polishing Head)...

AI Technical Summary

Problems solved by technology

It can be seen that the film-forming pattern at the edge of the wafer 5 is significantly thinner than the film-forming pattern near the middle of the wafer 5, and the uniformity of the film-forming pattern on the wafer 5 is poor

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