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Rigid-flex printed circuit board for sleeving and manufacturing method

A technology of rigid-flex board and manufacturing method, which is applied in the structural connection of printed circuits, the manufacture of printed circuits, and the processing of insulating substrates/layers, etc., can solve the complex process, high cost of cutting and connecting positions, and unreasonable design of connecting positions. and other problems, to simplify the sub-board process, improve the efficiency and quality of the sub-board, and avoid the appearance of carbonization and blackening.

Active Publication Date: 2020-07-24
SHENZHEN KINWONG ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the embodiments of the present application is to provide a rigid-flexible board for assembly, so as to solve the technical problems in the prior art that due to the unreasonable design of the connection position of the rigid-flexible board, the high cost and complicated process of cutting the connection position later

Method used

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  • Rigid-flex printed circuit board for sleeving and manufacturing method
  • Rigid-flex printed circuit board for sleeving and manufacturing method
  • Rigid-flex printed circuit board for sleeving and manufacturing method

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Embodiment Construction

[0028] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present application, and are not intended to limit the present application.

[0029] It should be noted that when an element is referred to as being “fixed” or “disposed on” another element, it may be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0030] It is to be understood that the terms "length", "width", "top", "bottom", "front", "rear", "left", "right", "vertical", "horizontal", "top" , "bottom", "inner", "outer" and oth...

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PUM

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Abstract

The invention provides a rigid-flexible printed circuit board for sleeving and a manufacturing method. The rigid-flexible printed circuit board for sleeving comprises a flexible layer, bonding layersand rigid layers; the rigid layers are connected with the upper and lower sides of the flexible layer through the bonding layers; flexible areas and rigid-flexible combination areas are formed on therigid-flexible printed circuit; a plurality of rigid clamping connection positions are arranged between the rigid-flexible combination areas on the two sides at intervals; the clamping connection positions are integrally formed on the rigid layer; the clamping connection positions of the flexible areas on the upper side and the lower side are arranged in a staggered mode, and the clamping connection positions jointly form a clamping supporting structure used for clamping and supporting the flexible layer corresponding to the flexible areas. According to the invention, rigid connection positions are arranged in the flexible areas; flexible connection positions can be prevented from being milled during board splitting; the rigid-flexible printed circuit board for sleeving can be split into single rigid-flexible printed circuit boards simply by adopting a mechanical milling mode; the procedures are few; the board splitting process is simplified; the operation is simple; the cost is low; the problem that the appearance is carbonized and blackened due to the fact that the flexible connection positions are cut by laser is avoided; and the board splitting efficiency and quality are improved.

Description

technical field [0001] The present application belongs to the technical field of circuit boards, and more specifically relates to a rigid-flexible combination board for packaging and a manufacturing method thereof. Background technique [0002] In order to improve the assembly efficiency, when the rigid-flex board is shipped to the component assembly factory, most of the cases are in the form of a set composed of several single pieces. The single piece and the rigid frame of the set are combined through the connection position. These connection positions are generally designed in Rigid area. However, when the flexible area is long, in order to prevent the flexible area from being bent and deformed, which will affect the operation, assembly and / or testing, it is necessary to design a connecting position in the flexible area to connect to the rigid casing frame. After the assembly of the components is completed, the assembly plant needs to divide the package board into indivi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K1/14H05K3/00
CPCH05K1/0281H05K1/147H05K3/0052
Inventor 张志强周源伟王俊侯利娟焦阳
Owner SHENZHEN KINWONG ELECTRONICS
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