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Film coating method and protective layer

A technology of protective layer and film layer, applied in the direction of coating, gaseous chemical plating, metal material coating process, etc., can solve the problems of high cost of coating fixture, prolonged coating time, affecting performance, etc., to improve coating yield, The effect of saving labor costs and shortening coating time

Pending Publication Date: 2020-07-17
JIANGSU FAVORED NANOTECHNOLOGY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This kind of shielding method will undoubtedly cause: (1) when removing the shielding, it will cause secondary damage to the electronic components, antenna shrapnel or circuit interface, which will affect its performance; (2) the process of shielding and de-masking is often carried out manually , can not be automated, which leads to the increase of labor costs and the extension of the coating time, which seriously affects the coating efficiency, and there may be adverse effects such as residual glue, which affects the yield of the coating process
[0005] Alternatively, a coating fixture with a coating hole is used to shield the non-coating part of the product to be coated, wherein the part of the product to be coated exposed in the coating hole can be coated with a film layer, and the non-coating part is covered by the coating fixture However, this type of coating jig is expensive and requires regular cleaning and maintenance, and one coating jig can only be used for one type or size of the product to be coated, which is limited by the product to be coated Its own shape, size, or the arrangement of electronic components or circuit interfaces on its surface has a greater influence

Method used

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  • Film coating method and protective layer
  • Film coating method and protective layer
  • Film coating method and protective layer

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Embodiment Construction

[0040] The following description serves to disclose the present invention to enable those skilled in the art to carry out the present invention. The preferred embodiments described below are only examples, and those skilled in the art can devise other obvious variations. The basic principles of the present invention defined in the following description can be applied to other embodiments, variations, improvements, equivalents and other technical solutions without departing from the spirit and scope of the present invention.

[0041] Those skilled in the art should understand that in the disclosure of the present invention, the terms "vertical", "transverse", "upper", "lower", "front", "rear", "left", "right", " The orientation or positional relationship indicated by "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, which are only for the convenience of describing the present invention...

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Abstract

The invention provides a film coating method and a protective layer. The film coating method comprises the following steps: A, at least one surface of an anti-deposition layer is formed on at least one surface of a substrate without a film coating component; and B, film coating treatment is performed on the substrate by a film coating device, wherein the anti-deposition layer prevents film-formingchemical molecules in the film coating process from being deposited on the surface of the anti-deposition layer to form a film.

Description

technical field [0001] The invention relates to the field of film coating, and further relates to a film coating method and a protective layer thereof. Background technique [0002] In recent years, the rapid development of coating technology, especially the maturity of vapor deposition technology, has made the use of surface coating technology to improve the performance of electronic products a technical hotspot. Surface coating technology can endow electronic products with properties such as high drop resistance, excellent scratch resistance, good heat dissipation, water resistance, underwater electrical resistance and corrosion resistance. Plasma chemical vapor deposition technology is a commonly used coating technology at present. Plasma is generated under the action of an electric field, and the gaseous substances containing the constituent atoms of the film are chemically reacted with the help of plasma, and a protective film is deposited on the surface of the product....

Claims

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Application Information

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IPC IPC(8): C23C16/04C23C16/44
CPCC23C16/042C23C16/44
Inventor 宗坚
Owner JIANGSU FAVORED NANOTECHNOLOGY CO LTD
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