Transformer chip element with rapid heat dissipation function

Abstract

The invention belongs to the technical field of chip elements, in particular to a transformer chip element with a rapid heat dissipation function. The radiator comprises a heat dissipation layer and ceramic heat conduction columns, wherein the surface of the heat dissipation layer is provided with shape and position holes, and a connecting end is arranged on the outer wall of the heat dissipationlayer; the connecting ends are distributed on the outer wall of the heat dissipation layer at equal intervals in the horizontal direction. A chip element body is mounted in the heat dissipation layer;the outer side of the chip element body is provided with heat conduction ceramic particles, the ceramic heat conduction column is fixed in the heat dissipation layer, the outer side of the chip element body is provided with a ceramic heat conduction sheet, the ceramic heat conduction sheet is internally provided with heat dissipation holes, and the heat dissipation layer is internally provided with a transformer winding. The transformer chip element with the rapid heat dissipation function is provided with a resin packaging layer composite packaging structure with an efficient heat dissipation effect, a composite structure magnetic core with ferrite magnetic conduction and outer ceramic heat conduction, and a packaging outer metal heat conduction and dissipation structure.

Description

technical field [0001] The invention relates to the technical field of transformer chip components, in particular to a transformer chip component with a rapid heat dissipation function. Background technique [0002] With the development of modern electronic manufacturing technology, electronic devices are required to have small volume, high integration and fast performance. The continuous improvement of integration will lead to the increase of power consumed by chip components, and the increase of power will further lead to the development of chip components. Heat increases, and temperature is one of the main factors to ensure the normal operation of the chip. If the heat dissipation capacity of the chip component is not enough to support the heat generated during its operation, the excess heat will increase the temperature of the active area and the PN junction inside the chip component. , which poses a challenge to the reliability of chip components, and even causes damage...

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Problems solved by technology

[0006] The object of the present invention is to provide a transformer chip component with rapid heat dissipation function to solve the problem of the existing transformer chip component with rapid heat dissipation function proposed in the above background technology. The resin packaging layer of similar products has poor heat dissipation effect and is not conducive to the electromagnetic structure of the chip. Problems with poor heat dissipation and heat conduction outside the packaging layer

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