A kind of aligned graphene/epoxy resin high thermal conductivity composite material and preparation method thereof

A directional arrangement, epoxy resin technology, applied in heat exchange materials, chemical instruments and methods, etc., can solve problems such as unhelpful waste recycling and environmental protection, difficult industrialized mass production, and fragile graphene films. Achieve the effect of reducing material cost, protecting the environment, and reducing the number of interfaces

Active Publication Date: 2021-04-06
SHANGHAI UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantages of this technical solution are: 1. The graphene film used is fragile, and the process of infiltrating the polymer and rolling it into a cylinder is difficult to operate, and it is difficult to carry out industrialized mass production
2. The raw material used is a complete graphene film, not the graphene soaking film fragments of recycling or industrial waste, which is costly and not conducive to the recycling of waste and environmental protection

Method used

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  • A kind of aligned graphene/epoxy resin high thermal conductivity composite material and preparation method thereof
  • A kind of aligned graphene/epoxy resin high thermal conductivity composite material and preparation method thereof
  • A kind of aligned graphene/epoxy resin high thermal conductivity composite material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] See attached Figure 1~3 , the oriented arrangement graphene / epoxy resin high thermal conductivity composite material provided in this embodiment, it is 5~20 μm by oriented arrangement thickness, the graphene soaking film fragments that lateral dimension is 0.5~3mm is used as heat conduction filler, and pouring And the epoxy resin covering the heat conducting material is solidified at high temperature together, so that the graphene heat soaking film fragments are finally oriented and arranged; calculated according to the mass percentage, it is made of the following ratio of graphene heat soaking film fragments and epoxy resin Composition: Graphene soaking film fragments: 32.63%, epoxy resin: 67.37%.

[0044] The graphene heat soaking film fragments are made by recycling and pulverizing the remaining corner waste after die cutting of the graphene heat soaking film commonly used in the electronics industry.

[0045] The preparation method of the aligned graphene / epoxy re...

Embodiment 2

[0053] see figure 2 , the aligned graphene / epoxy resin high thermal conductivity composite material and preparation method thereof provided by the present embodiment are basically the same as in Example 1, except that:

[0054] Calculated by mass percentage, it is made of graphene heat soaking film fragments and epoxy resin in the following proportions: graphene heat soaking film fragments: 28.5%, epoxy resin: 71.5%.

[0055] (1) Mechanically pulverize the waste graphene heat soaking film with a thickness of 5 μm for 3 minutes, sieve, and select the graphene heat soaking film fragments filtered out with a sieve diameter between 0.5 and 3 mm for future use.

[0056] (2) Divide the fragments of the graphene soaking film into 10 parts, 1 part of which is evenly added to a specific mold through the side feed port, and then gently cover the equalizer plate on the fragments of the graphene soaking film, and place The upper part of the mold, the surroundings and the feed port are s...

Embodiment 3

[0062] The oriented arrangement graphene / epoxy resin high thermal conductivity composite material and preparation method thereof provided in this embodiment are basically the same as one of Embodiments 1 and 2, except that:

[0063] Calculated by mass percentage, it is made of graphene heat soaking film fragments and epoxy resin in the following proportions: graphene heat soaking film fragments: 20%, epoxy resin: 80%.

[0064] The thermal conductivity of the epoxy resin / aligned graphene heat soaking film composite material along the arrangement direction of the graphene heat soaking film is 10W / (m·K).

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Abstract

The invention discloses an oriented arrangement graphene / epoxy resin composite material with high thermal conductivity, which is characterized in that it uses oriented arranged graphene soaking film fragments with a thickness of 5-20 μm and a lateral size of 0.5-3 mm as heat conduction materials. The filler is cured at high temperature together with the epoxy resin that pours and covers the heat-conducting material, so that the graphene heat-spreading film fragments complete the final alignment. The invention also discloses a preparation method thereof. The industrial graphene heat soaking film scraps are mechanically crushed to obtain graphene heat soaking film fragments, the graphene heat soaking film fragments are stacked in a mold, and epoxy resin is injected into the mold filled with fillers. , multiple times of vacuum defoaming and high temperature curing to obtain the material. The graphene soaking film used in the present invention is derived from industrial waste, which can realize waste utilization; the prepared composite material has excellent thermal conductivity due to the high orientation of the filler; the method of realizing alignment and orientation is simple mechanical extrusion or positive air flow, and the steps are simple , Easy to realize industrialized production.

Description

technical field [0001] The invention relates to the field of heat-conducting polymer composite materials, and more specifically relates to an aligned graphene / epoxy resin high heat-conducting composite material and a preparation method thereof. Background technique [0002] The advancement of science and technology makes the heat dissipation of electronic products a key factor in maintaining the performance and reliability of electronic equipment. Similarly, in some emerging technology industries, including: new energy vehicles, flexible wearable electronic devices, light-emitting diodes, etc., new thermal conductive materials are required. [0003] Filled thermally conductive polymer composites with excellent thermal conductivity can usually be prepared by filling the polymer with fillers with high thermal conductivity. This method is widely used in the preparation of thermally conductive polymer composite materials at the present stage due to its advantages of simple proc...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08K3/04C09K5/14B29C70/62
CPCB29C70/62C09K5/14C08K3/042C08L63/00
Inventor 王金合施利毅余品璇刘慧
Owner SHANGHAI UNIV
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