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Directionally-arranged graphene/epoxy resin high-thermal-conductivity composite material and preparation method thereof

A technology of directional alignment and epoxy resin, which is applied in the direction of heat exchange materials, chemical instruments and methods, etc., can solve the problems that are not beneficial to waste recycling and environmental protection, difficult to industrialize mass production, and graphene film is fragile. Achieve the effects of reducing material costs, protecting the environment, and reducing the number of interfaces

Active Publication Date: 2020-07-10
SHANGHAI UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantages of this technical solution are: 1. The graphene film used is fragile, and the process of infiltrating the polymer and rolling it into a cylinder is difficult to operate, and it is difficult to carry out industrialized mass production
2. The raw material used is a complete graphene film, not the graphene soaking film fragments of recycling or industrial waste, which is costly and not conducive to the recycling of waste and environmental protection

Method used

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  • Directionally-arranged graphene/epoxy resin high-thermal-conductivity composite material and preparation method thereof
  • Directionally-arranged graphene/epoxy resin high-thermal-conductivity composite material and preparation method thereof
  • Directionally-arranged graphene/epoxy resin high-thermal-conductivity composite material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] See attached Figure 1~3 , the oriented arrangement graphene / epoxy resin high thermal conductivity composite material provided in this embodiment, it is 5~20 μm by oriented arrangement thickness, the graphene soaking film fragments that lateral dimension is 0.5~3mm is used as heat conduction filler, and pouring And the epoxy resin covering the heat conducting material is solidified at high temperature together, so that the graphene heat soaking film fragments are finally oriented and arranged; calculated according to the mass percentage, it is made of the following ratio of graphene heat soaking film fragments and epoxy resin Composition: Graphene soaking film fragments: 32.63%, epoxy resin: 67.37%.

[0044] The graphene heat soaking film fragments are made by recycling and pulverizing the remaining corner waste after die cutting of the graphene heat soaking film commonly used in the electronics industry.

[0045] The preparation method of the aligned graphene / epoxy re...

Embodiment 2

[0053] see figure 2 , the aligned graphene / epoxy resin high thermal conductivity composite material and preparation method thereof provided by the present embodiment are basically the same as in Example 1, except that:

[0054] Calculated by mass percentage, it is made of graphene heat soaking film fragments and epoxy resin in the following proportions: graphene heat soaking film fragments: 28.5%, epoxy resin: 71.5%.

[0055] (1) Mechanically pulverize the waste graphene heat soaking film with a thickness of 5 μm for 3 minutes, sieve, and select the graphene heat soaking film fragments filtered out with a sieve diameter between 0.5 and 3 mm for future use.

[0056] (2) Divide the fragments of the graphene soaking film into 10 parts, 1 part of which is evenly added to a specific mold through the side feed port, and then gently cover the equalizer plate on the fragments of the graphene soaking film, and place The upper part of the mold, the surroundings and the feed port are s...

Embodiment 3

[0062] The oriented arrangement graphene / epoxy resin high thermal conductivity composite material and preparation method thereof provided in this embodiment are basically the same as one of Embodiments 1 and 2, except that:

[0063] Calculated by mass percentage, it is made of graphene heat soaking film fragments and epoxy resin in the following proportions: graphene heat soaking film fragments: 20%, epoxy resin: 80%.

[0064] The thermal conductivity of the epoxy resin / aligned graphene heat soaking film composite material along the arrangement direction of the graphene heat soaking film is 10W / (m·K).

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Abstract

The invention discloses a directionally-arranged graphene / epoxy resin high-thermal-conductivity composite material. The graphene soaking film fragments which are arranged directionally and have a thickness of 5-20 microns and a lateral size of 0.5-3mm are used as heat-conducting filler, and the graphene soaking film fragments and epoxy resin which is poured and coats a heat-conducting material arecured together at high temperature, so that the graphene soaking film is prepared by finishing final directional arrangement of the graphene soaking film fragments. The invention also relates to a preparation method, which comprises the following steps: mechanically crushing industrial graphene soaking film leftover materials to obtain graphene soaking film fragments, filling the graphene soakingfilm fragments into a mold, injecting epoxy resin into the mold filled with the filler, carrying out vacuum defoaming for multiple times, and carrying out high-temperature curing to obtain the material. The graphene soaking film adopted by the invention is derived from industrial waste, so that waste utilization can be realized; the prepared composite material is high in filler orientation, so that the heat-conducting property is excellent; the method for realizing arrangement orientation is simple mechanical extrusion or airflow positive pressure, the steps are simple, and industrial production is easy to realize.

Description

technical field [0001] The invention relates to the field of heat-conducting polymer composite materials, and more specifically relates to an aligned graphene / epoxy resin high heat-conducting composite material and a preparation method thereof. Background technique [0002] The advancement of science and technology makes the heat dissipation of electronic products a key factor in maintaining the performance and reliability of electronic equipment. Similarly, in some emerging technology industries, including: new energy vehicles, flexible wearable electronic devices, light-emitting diodes, etc., new thermal conductive materials are required. [0003] Filled thermally conductive polymer composites with excellent thermal conductivity can usually be prepared by filling the polymer with fillers with high thermal conductivity. This method is widely used in the preparation of thermally conductive polymer composite materials at the present stage due to its advantages of simple proc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K3/04C09K5/14B29C70/62
CPCB29C70/62C09K5/14C08K3/042C08L63/00
Inventor 王金合施利毅余品璇刘慧
Owner SHANGHAI UNIV
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