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Double-sided adhesive tape punching process

A double-sided tape and process technology, applied in metal processing and other directions, can solve the problems of unstable product dimensional tolerances, changes in outer frame dimensions, and high difficulty in mold adjustment, saving mold adjustment time, reducing mold adjustment difficulty, and reducing cumulative tolerances Effect

Active Publication Date: 2020-06-09
东莞六淳智能科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When punching double-sided adhesive products, some parts with holes in the middle will use the same positioning column and positioning hole to punch the inner and outer frames of the product, which is prone to cumulative tolerances, resulting in unstable product dimensional tolerances. When adjusting the mold, adjusting the tolerance of the inner frame will easily lead to changes in the size of the outer frame, making it difficult to adjust the mold

Method used

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  • Double-sided adhesive tape punching process
  • Double-sided adhesive tape punching process
  • Double-sided adhesive tape punching process

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specific Embodiment 1

[0022] Specific embodiment 1: Please refer to Figure 1 to Figure 7 In an embodiment of the present invention, a double-sided tape punching process includes die-cutting using a knife die and includes the following steps:

[0023] (A) In the laminating machine, the adhesive surface 101 of the double-sided tape 1 and the blue film 2 are attached to form a roll. The double-sided tape includes the adhesive surface 101 and the release bottom paper 102, and the blue film 2 is attached At the top of the rubber surface 101, the release paper 102 is at the bottom of the rubber surface 101;

[0024] (B) The roll of material in step A is punched with the first die 3, the first positioning holes 6 are punched on the left and right sides of the roll, and the knife edge 201 is punched between the two first positioning holes 6. The blue film 2 at the broken edge 201 is cut and the glue is continuous, and a semi-finished product 1 is obtained;

[0025] (C) The semi-finished product in step C is pu...

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Abstract

The invention provides a double-sided adhesive tape punching process. The double-sided adhesive tape punching process comprises the following steps of performing die cutting by using a cutting die, laminating the adhesive surface of a double-sided adhesive tape and a blue film by using a laminating machine to form a material coil, punching by using a first cutting die, punching first positioning holes in the left side and the right side of the material coil, and punching a broken knife edge between the two first positioning holes; punching by using a second cutting die, and punching an inner frame and a second positioning hole of the product on the second cutting die by using the first positioning hole; and punching by using a third cutting die, punching the shape of the outer frame of theproduct on the third cutting die by using the second positioning hole, punching the outer frame into a full-penetration shape, and punching into a single product to obtain a finished product. Compared with the prior art, the double-sided adhesive tape punching process adopts different trepan borings to punch a product structure, reduces accumulated tolerance, ensures that dimensional tolerance values of an inner frame and an outer frame of a product can be easily controlled, can independently adjust the size of the outer frame or the inner frame without correlation change, reduces the mold adjusting difficulty, and saves the mold adjusting time.

Description

Technical field [0001] The invention relates to the technical field of die-cutting, in particular to a double-sided tape punching process. Background technique [0002] Die-cutting products are widely used in the electronic and electrical industry, automobile manufacturing industry, flat-panel display industry and other industrial fields, especially the products that are applied to layered thin materials during the preparation process, such as insulating materials, shockproof materials, heat-resistant materials, and adhesive stickers Materials, dustproof materials, shielding materials, etc., all require die-cutting technology for processing and manufacturing. Die-cutting products have a wide range of applications, widely used in high-tech products such as electronics, electrical appliances, instruments, communication equipment, digital products, medical equipment, etc., and play different roles in different products. When punching double-sided tape products, some parts with hole...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B26D9/00B26F1/02B26F1/40B26F1/44
CPCB26D9/00B26F1/02B26F1/40B26F1/44
Inventor 莫舒润吴堂谊
Owner 东莞六淳智能科技股份有限公司
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