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An LED packaging device with increased light output angle and display application

A technology of LED packaging and light output angle, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of affecting the mixed light effect, the distance between LED lamp beads and diffusion plates cannot be further reduced, and the limitation of thinness of display devices, etc.

Active Publication Date: 2021-09-10
YANCHENG DONGSHAN PRECISION MANUFACTURING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The light emitting angle of the existing LED packaging device is in the range of 120° to 130°. In order to ensure a better visual effect, a 32-inch TV needs to use 26,000 LED lamp beads, and the manufacturing cost is high. Reducing the number of LED lamp beads will affect the mixed light effect and cause poor visual effect
In addition, due to the small light emitting angle of the existing LED packaging device, the distance between the LED lamp bead and the diffuser plate cannot be further reduced, which limits the thinness of the display device

Method used

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  • An LED packaging device with increased light output angle and display application
  • An LED packaging device with increased light output angle and display application

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Embodiment Construction

[0035] Such as figure 1 As shown, a kind of encapsulation process of the LED encapsulation device of the present invention that increases luminous angle comprises steps:

[0036] (A) Solid crystal and wire bonding on the substrate;

[0037] (B) Use pure silica gel, silicone resin, and epoxy resin to mix evenly in proportion, and use a defoamer to form the first glue after defoaming;

[0038] (C) using the first glue on the substrate to press the film to form a glue layer;

[0039] (D) Printing or vacuum sputtering or spraying or second lamination on the surface of the adhesive layer;

[0040] (E) Long baking and cutting to form LED devices.

[0041] Wherein, the defoaming parameters of the defoaming machine in the step (B) are 500 rpm for 30 s / vacuum 30 kPa, 800 rpm for 1 minute 50 s / vacuum 1.5 kPa, and 600 rpm for 50 s / vacuum 1.8 kPa to ensure uniform mixing.

[0042] In the step (C) after pressing the film, place it for 5-10 minutes to ensure that the surface of the adhe...

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Abstract

The invention discloses an LED packaging device with increased light output angle and its display application. The packaging process of the LED package device with increased light output angle includes the following steps: (A) bonding crystals and wires on a substrate; (B) using Pure silica gel, silicone resin, and epoxy resin are mixed evenly in proportion, and the first glue is formed after degassing with a defoaming machine; (C) the first glue is used to press the film on the substrate to form a glue layer; (D) the glue layer is formed Printing or vacuum sputtering or spraying or second lamination on the surface; (E) long baking and cutting to form LED devices. The LED encapsulation device with increased luminous angle has a large luminous angle, and the display application using the LED encapsulation device has good display effect, low production cost, and can be designed to be thinner.

Description

technical field [0001] The present invention relates to the related technical field of display technology, more precisely, relates to an LED packaging device and a display application that increases the light output angle. Background technique [0002] Light-emitting diodes (LEDs) have the advantages of small size, long service life, energy saving and environmental protection, fast response, ruggedness and durability, and are ideal light sources to replace traditional light sources. Light-emitting diodes are now widely used in automotive and interior lighting, traffic lights, screen displays, and LCD backlighting. The packaging process is a very important process in the LED manufacturing process, which has a very significant impact on the performance and cost of the LED. In the field of display, as the requirements for thinness, clarity, and display size continue to increase, the requirements for the backlight module of the display device also continue to increase, and acco...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48H01L33/54H01L33/56H01L33/62
CPCH01L33/48H01L33/54H01L33/56H01L33/62H01L2933/0033H01L2933/005H01L2933/0066
Inventor 黄勇鑫牛艳玲何静静
Owner YANCHENG DONGSHAN PRECISION MANUFACTURING CO LTD
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