Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A macro-micro compound constant pressure polishing device and method

A polishing device and polishing head technology, applied in the field of optical polishing, can solve the problems of large pressure control range, large polishing pressure, error, etc., and achieve the effect of high polishing precision

Active Publication Date: 2021-10-01
广州精点科技有限公司
View PDF13 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this method has a large pressure control range, which is prone to overshoot and makes the polishing pressure too high.
The Chinese invention patent with the publication number CN104772661A is a processing method for full-band high-precision aspheric optical elements. Iterative processing is used to gradually converge the polished surface shape, but the polishing iteration time is long
[0005] Due to the errors of various factors in the existing patented polishing technology, including polishing pressure, polishing speed, polishing residence time and the precision of the equipment, the convergence time of the polished surface shape error is long, and it needs to undergo multiple superimposed polishings to gradually converge.
Among them, constant pressure polishing is difficult to control within a small error range, resulting in excessive errors between the polishing removal model and theoretical calculations, which eventually lead to errors between the actual polishing effect and the theoretical polishing effect

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A macro-micro compound constant pressure polishing device and method
  • A macro-micro compound constant pressure polishing device and method
  • A macro-micro compound constant pressure polishing device and method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0023] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0024] Such as figure 1 As shown, the present invention provides an implementation case of a macro-micro compound constant pressure polishing device and method, which includes an adjustment weight 1, a force applying lever 2, a force transmission lever 3, an air flotation guide block 4, a pressure sensor 5, a mold Jen 6, permanent magnet 7, magnetic device 8, left and right moving table 9, up and down lifting table 10, up and down lead screw 11, pressure controller 12, polishing head 13, air bearing guide rail 14, left and right lead screw 15, rotating shaft 16, adjustment The weight 1 is connected with the force applying lever 2, the force applying lever 2 is connected with the force transmission lever 3, the force transmission lever 3 is connected with the air f...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a macro-micro compound constant-pressure polishing device and method. The method comprises the following steps: adjusting the polishing pressure by utilizing the lever structure, the counterweight at both ends of the lever and the change of the force arm of the lever; When the surface of the core is polished, the polishing position is controlled by the left and right moving axis and the rotating swing axis, and the position of the polishing point in the vertical direction of the mold core is controlled by the space up and down servo axis, which is guaranteed macroscopically by combining the principle of leverage. The polishing pressure is stable; the polishing head is equipped with a pressure sensor and an electromagnetic force device. According to the change of the polishing pressure, the electromagnetic force device is controlled to adjust and compensate the change of the polishing pressure microscopically. The closed-loop control ensures the constant pressure of the polishing process. The present invention controls the constant polishing pressure through a macro-micro compound method, and has higher control precision.

Description

technical field [0001] The invention relates to the technical field of optical polishing, in particular to a macro-micro composite constant pressure polishing device and method. Background technique [0002] With the development of optoelectronic technology, more and more aspherical lenses are used in optical systems to improve the disadvantages of large aberration, small field of view and large volume of optical systems in traditional spherical lens optical systems. There are two commonly used aspheric lens manufacturing techniques, cold processing and hot pressing. Cold processing technology includes grinding and polishing of lens blanks. This technology has low production efficiency and is often used in the manufacture of large-diameter optical lenses in the fields of astronomy and military industry. Hot press forming technology uses high-precision molds to heat the lens blank and apply a certain pressure when the glass lens is in a high elastic state. After a certain pe...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): B24B13/00B24B49/16B24B41/00
CPCB24B13/00B24B41/007B24B49/165
Inventor 朱相优张嘉荣邓建南卓少木
Owner 广州精点科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products