SoC chip structure for infrared sensor signal acquisition integrated system

Abstract

The invention discloses an SoC chip structure for an infrared sensor signal acquisition integrated system. The SoC chip structure comprises a CPU subsystem, a memory subsystem, an algorithm subsystem,an input sampling subsystem, a data output subsystem, a control output subsystem, a universal peripheral subsystem, a clock reset subsystem, an AHB bus, a bridge and an APB bus. The SoC chip structure is advantaged in that the on-chip integrated subsystem can collect, analyze, process and output image signals of an infrared sensor signal system, a temperature monitoring function is realized, a single chip of the infrared sensor signal acquisition integrated system is realized, =problems of high system development complexity, large size and high power consumption of a discrete device integration implementation scheme in an infrared sensor signal acquisition integrated system are solved, secondary integrated application by a user is facilitated, and similar application requirements in the field of infrared image processing can be met.

Description

technical field [0001] The invention relates to the field of infrared image processing, in particular to an SoC chip structure used in an infrared sensor signal acquisition integrated system. Background technique [0002] The integrated infrared sensor signal acquisition system includes infrared sensor signal conditioning, acquisition, adaptive gain and bias control, image preprocessing and transmission, sensor bias power management, detector timing generation, temperature monitoring and other functional integrations. Program the microprocessor. It is necessary to realize the integrated system of infrared sensor signal acquisition, which requires ADC to collect image signals, through gain feedback technology, then through adaptive image algorithm processing, and finally through parallel-to-serial conversion output. According to the control requirements of the integrated infrared sensor signal acquisition system, the integrated infrared sensor signal acquisition system needs...

AI Technical Summary

Problems solved by technology

For the uncooled infrared imaging system, my country has developed a 320×240 thermistor focal plane array sensor, a long-wave infrared lens, and its image signal processing circuit components include ADC, digital signal processor (DSP), embedded PC and Liquid crystal display, etc., but so far, there is no multi-functional high-precision signal acquisition system chip product in China

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