Surface acoustic wave filter packaging structure and manufacturing method thereof

Abstract

The invention discloses a surface acoustic wave filter packaging structure. The structure comprises a dielectric substrate, wherein the substrate comprises a dielectric layer, a first patterned conductive layer, a second patterned conductive layer and a conductive connecting layer, the conductive connecting layer is arranged in the dielectric layer and electrically connected with the first patterned conductive layer and the second patterned conductive layer which are arranged on the two sides of the dielectric layer respectively and the second patterned conductive layer is at least provided with an interdigital electrode part, a chip, wherein the active surface of the chip is opposite to the interdigital electrode part, a polymer sealing frame body which is arranged between the chip and the dielectric substrate and is arranged at the periphery of the chip in a surrounding manner, so that the polymer sealing frame body, the chip and the dielectric substrate form a closed cavity together, and a mold sealing layer which is arranged on the dielectric substrate and covers the chip and the polymer sealing frame body. The invention further provides a manufacturing method of the surface acoustic wave filter packaging structure.

Description

technical field [0001] The present invention relates to a semiconductor package and its manufacturing method, and in particular to a surface acoustic wave filter packaging structure and its manufacturing method. Background technique [0002] Surface acoustic wave filter (Surface Acoustic Wave filter, SAW filter) is a common component in communication systems. Its operating principle is to convert the received electrical signal into mechanical waves in piezoelectric materials. Due to the delay in the transmission of mechanical waves through piezoelectric materials , and then through the output electrode to convert the delayed mechanical wave into electrical energy signal. By combining the delayed output signal to reproduce the result, the goal of filtering unnecessary signals and noise and improving the quality of receiving can be achieved. [0003] At the same time, due to the design flexibility of the surface acoustic wave filter, analog / digital compatibility, excellent gr...

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Problems solved by technology

[0006] However, in the design of the electrical connection of the existing surface acoustic wave filter packaging structure of the wafer level package, the upper chip 15 and the lower chip 11 are first connected and bonded, and then the electroplating process is used to form an electroplated metal outside the package structure. thin film 16, which not only fails to simplify the manufacturing process, but also easily contaminates or damages the chip in the related process, resulting in the failure to improve the yield control and cost control of the process.

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