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Repair process of stack-shaped/I-shaped preset solder terminal connector

A terminal connector and preset technology, applied in the direction of electrical components, electrical components, etc., can solve problems such as difficulty in ensuring product reliability, welding, and increased rework costs, so as to avoid short-circuit tinning, reduce the risk of deformation, and improve utilization. rate effect

Active Publication Date: 2020-05-12
无锡市同步电子制造有限公司
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AI Technical Summary

Problems solved by technology

[0003] However, the stacked / I-shaped pre-soldered terminal connector has a special solder end structure design. Once the device needs to be reworked for any reason after soldering, the connector that loses the pre-soldered solder will no longer be able to ensure product reliability. The above-mentioned conventional The BGA rework solution can only disassemble the device and directly re-use the new device for soldering, resulting in increased soldering and rework costs

Method used

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  • Repair process of stack-shaped/I-shaped preset solder terminal connector

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Embodiment Construction

[0032] The specific embodiments of the present invention will be further described below in conjunction with the accompanying drawings.

[0033] This application discloses a rework process for stacked / I-shaped pre-set solder terminal connectors, please refer to figure 1 As shown in the flowchart, the rework process includes:

[0034] 1. Fix the component to be repaired on the rework and desoldering station, fix the four corners of the component to be repaired, and when the length of the component to be repaired exceeds 200mm and / or the width exceeds 150mm, add a thimble to the middle of the component to be repaired to fix. This step can prevent the component to be reworked from being deformed due to thermal stress during the heating process of the rework station.

[0035] 2. Heating the device disassembly area of ​​the component to be repaired. In this application, heating is not performed at a constant temperature, but according to a preset heating curve. The entire heating...

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Abstract

The invention discloses a repair process of a stack-shaped / I-shaped preset solder terminal connector, and relates to the technical field of semiconductor processing. The method comprises the followingsteps f: firstly checking a disassembled device, and when the performance of the disassembled device is excellent, directly selecting a disassembled stack-shaped / I-shaped connector without preset welding flux as a welding device to be welded on a PCBA plate again, thereby improving the utilization rate of the device and reducing the repair cost; in the process of repair welding, proposing an innovative method for determining the size of a solder ball, so the short-circuit tin connection can be avoided while the tin soldering amount is guaranteed; performing coating of soldering paste on a soldering lug before soldering, thereby facilitating the improvement of the repair success rate and the soldering reliability of the device, and achieving high-reliability reworking of the stack-shaped / I-shaped preset solder terminal connector.

Description

technical field [0001] The invention relates to the technical field of semiconductor processing, in particular to a rework process for stack-shaped / I-shaped pre-set solder terminal connectors. Background technique [0002] As a high-density connector, the stacked / I-shaped pre-soldered terminal connector is mainly used in high-speed board-to-board interconnection (board-to-board) applications with a product data rate of 56Gbps, which uses a grid array package similar to BGA The pre-set solder terminal (solder charge) for connection. At present, the following rework schemes are commonly used in the industry for ball grid array packaged devices: use hot air / infrared heating rework and desoldering station to remove the problematic device from the printed board, and use the solder suction rope to completely remove the device pad and printed board Solder the residual solder on the pad, and then plant solder balls of appropriate size on the side of the device pad, and print solder...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K13/04
CPCH05K13/04H05K13/0486
Inventor 潘一峰漆长江袁波解丽雯沈娟
Owner 无锡市同步电子制造有限公司
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