Guiding mechanism and planarization equipment

Abstract

The invention discloses a guiding mechanism and planarization equipment, and relates to the technical field of wafer manufacturing. The guiding mechanism comprises a base, a bearing and a supporting rod arranged on the top of the base, wherein the bearing is connected to the supporting rod in a sleeving manner. The guiding mechanism also comprises an abutting part, wherein the abutting part is fixedly connected to the top of the supporting rod; and an inner ring of the bearing is clamped and fixed between the abutting part and the base. When the base of the guiding mechanism and an outer ringof the bearing are separately connected to two parts which rotate relative to each other, the guiding mechanism can be used as a relative rotation medium between the two parts so as to achieve the rotation guiding of the two rotating parts and ensure the stable rotation of the two parts. The planarization equipment comprises the guiding mechanism and also comprises a planarization wheel, planarization assemblies and a connecting assembly. The base of the guiding mechanism and the outer ring of the bearing are separately connected to the planarization wheel and the connecting assembly which rotate relative to each other, so that the rotation guiding of the planarization wheel and the connecting assembly can be realized so as to further ensure that the planarization assemblies rotate stablyunder the limitation of the connecting assembly.

Description

technical field [0001] The invention relates to the technical field of wafer manufacturing, in particular to a guiding mechanism and polishing equipment. Background technique [0002] Chemical Mechanical Planarization (CMP) is a method of smoothing wafers or other substrate materials by means of chemical etching and mechanical processing. The CMP process includes physical processes and chemical processes. Among them, the chemical process is that the chemicals in the polishing liquid react chemically with the wafer, and generate substances that are easier to remove on the surface of the wafer, while the physical process uses the abrasive particles in the polishing liquid to physically interact with the wafer surface. Rubbing creates a smooth wafer by removing material from its surface. However, in the process of physical friction, the problem of shaking of the throwing head is prone to occur, resulting in uneven polishing of the wafer surface, thereby affecting product quali...

AI Technical Summary

Problems solved by technology

However, in the process of physical friction, the problem of shaking of the throwing head is prone to occur, resulting in uneven polishing of the wafer surface, thus affecting product quality

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