Machining system and method for glass taper-free precision deep hole array

Abstract

The invention discloses a machining system for a glass taper-free precision deep hole array. The machining system sequentially comprises a laser, a beam expander, a dynamic beam shaping system, a galvanometer, a machining objective lens and a glass workpiece along a light path propagation path; the glass workpiece is mounted on a tooling fixture; the machining system also comprises an auxiliary system which is used for removing dust remained in holes in the laser drilling process; and a laser spot formed by the machining objective lens firstly acts on the lower surface of the glass workpiece,and the laser perforates the glass workpiece from bottom to top by adjusting the depth of the spot in the glass workpiece. The auxiliary system is positioned below the glass workpiece and removes dustgenerated in the laser drilling process below the glass workpiece, so that the problems of back surface damage and the like caused by the laser transmission effect of front surface machining are solved.

Description

technical field [0001] The invention belongs to the technical field of laser processing, and specifically relates to a processing system and method for glass non-taper precision deep hole arrays, which are suitable for transparent and brittle materials such as various glasses, and can be applied to 3C industries such as air-permeable array holes and heat dissipation array holes. The required precision deep hole array processing. Background technique [0002] Glass has good light transmission performance and good chemical stability. Therefore, it is widely used in construction industry, daily use, art, medical treatment, chemistry, electronics, instrumentation, optical devices and so on. [0003] However, since the tensile strength of glass is much lower than the compressive strength, it is a typical brittle material, so defects such as cracks are prone to occur during the processing of glass, which affects the strength of the product. The traditional laser micro deep hole ...

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Problems solved by technology

[0007] The purpose of the present invention is to address the problems existing in the prior art, to provide a processing system and method for glass non-tapered precision deep hole arrays, which solves the problem of dust accumulation in micro-hole processing, damage to the edge surface of the hole processing, and the processing of single holes. inefficiency etc.

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