A packaging method for densely arranging semiconductor chips for Internet of Things terminals

Abstract

The invention discloses a packaging method for densely arranging semiconductor chips for an Internet of Things terminal, belonging to the field of semiconductor packaging, and a packaging method for densely arranging semiconductor chips for an Internet of Things terminal, including the upper surface of a lower casing There is a placement slot, and two sets of conductive columns are fixedly connected to the upper surface of the lower case, and the two sets of conductive posts are respectively located on both sides of the placement slot, and there are perforations in the lower case, and the perforations are located below the conductive posts. Pins are placed in the center, and the upper ends of the pins are fixedly connected with the conductive columns, the bottom of the placement groove is bonded with adhesive, the chip is placed in the placement groove, and the lower end of the chip is bonded with the adhesive, the upper surface of the chip is It can realize the indirect connection between the chip and the pins by connecting multiple wires to the conductive posts, so as to prevent the pins from being involved in the chip and causing the chip to shake or be damaged. effect without damaging the chip.

Description

technical field [0001] The present invention relates to the field of semiconductor packaging, and more specifically, to a packaging method for densely arranging semiconductor chips used in Internet of Things terminals. Background technique [0002] Packaging technology is necessary and crucial for the chip, because the chip must be isolated from the outside world to prevent impurities in the air from corroding the chip circuit and causing electrical performance degradation. On the other hand, the packaged chip is also more It is convenient for installation and transportation, because the packaging technology directly affects the performance of the chip itself and the design and manufacture of the PCB connected to it, so it is very important. [0003] At present, there are many ways to package semiconductor chips, but they are similar. Most of the connection methods between the chip and the pins are directly connected. Since the pins are extended to the outside of the package...

AI Technical Summary

Problems solved by technology

[0003] At present, there are many ways to package semiconductor chips, but they are similar. Most of the connection methods between the chip and the pins are directly connected. Since the pins are extended to the outside of the package, the pins will be accidentally pulled during installation or transportation. pins, it is easy to tear the chip inside the package, and the connection between the chip and the pin is also easy to be torn off. In addition, when the chip is finally plastic-packed, the plastic shell must press the chip. If the control is not good, it is easy to cause damage to the chip.

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