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Power supply device and single board

A technology of power supply device and power supply unit, which is applied in the direction of circuit devices, high-current matching devices, printed circuit components, etc., and can solve problems such as power supply failure, increased PCB cost, and increased PCB layers.

Inactive Publication Date: 2020-04-24
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this will lead to an increase in the number of layers of the PCB, which will immediately increase the cost of the PCB. In addition, the more layers of the PCB, the higher the processing difficulty, and the number of layers is difficult to increase without limit with the increase of the flow area.
Therefore, if the existing power supply device is used to supply power to chips with high power consumption, there is a huge risk of power failure

Method used

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  • Power supply device and single board
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  • Power supply device and single board

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Embodiment Construction

[0035]In order to facilitate the understanding of the power supply device provided by the embodiment of the present application, the application scenarios of the power supply device provided by the embodiment of the present application will be explained first below. The power supply device can be installed in electronic devices such as mobile phones, tablet computers, and PDAs. In the electronic device, it can realize the power supply to the devices waiting for power supply on the chips on the single board. Wherein, the device to be powered includes but not limited to a central processing unit (central processing unit, CPU), an artificial intelligence (artificial intelligence, AI) processor, a system on chip (system on chip, SoC) or a power management unit.

[0036] refer to figure 1 , figure 1 A schematic structural diagram of a single board of an electronic device is provided. The single board may include a power supply device and a communication module 001 . Wherein, the...

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Abstract

The invention provides a power supply device and a single board, and relates to the technical field of power supply. The power supply device comprises a printed circuit board, a power supply module arranged on the printed circuit board, a to-be-powered device and a through-current module. The power supply module and the to-be-powered device are arranged on the first surface of the printed circuitboard. The through-flow module is arranged on the second surface of the printed circuit board, and the second surface is opposite to the first surface. The power supply module is electrically connected with the to-be-powered device through the through-flow module. Therefore, the current output from the power supply module can be transmitted to the to-be-powered device through the through-flow module, so as to achieve the power supply of the power supply module to the to-be-powered device. By adopting the scheme, the transmission path of current is short, and the loss of the current in the transmission process can be reduced. In addition, the increase of the number of layers of the printed circuit board can be effectively avoided, so that the cost of the printed circuit board is reduced.

Description

technical field [0001] The present application relates to the technical field of power supply, in particular to a power supply device and a single board. Background technique [0002] As the scale of the chip becomes larger and the function becomes stronger, the power consumption required by the chip becomes higher and higher, and the power consumption of some single chips has reached hundreds of watts. Currently, the current output by the power supply module is usually routed inside a printed circuit board (PCB), and then enters the chip through a pin (pin) of the chip, so as to supply power to the chip. [0003] When the power consumption of the chip is large, the required power supply current is relatively large, and the power supply current must be supplied to the chip through the PCB. Due to the limited area of ​​the single-layer structure of the PCB, it is necessary to arrange a multi-layer structure in the PCB for wiring, so as to meet the requirement of the flow are...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K1/18
CPCH05K1/0263H05K1/18
Inventor 邓治高刘伟
Owner HUAWEI TECH CO LTD
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