Laser cutting device and method for controlling plasma through electromagnetic field to regulate and control crack expansion

Abstract

The invention discloses a laser cutting device and method for controlling plasma through an electromagnetic field to regulate and control crack expansion. The device comprises a multi-axis moving platform (9), an imaging system for obtaining surface images of a machining workpiece (14) on the multi-axis moving platform (9), a hidden cutting device used for generating laser beams (15) and an electromagnetic field generation device used for generating electric field force and magnetic field force applied to the plasma, wherein the laser beams (15) are gathered into the machining workpiece (14),and workpiece materials are gasified and ionized into the plasma. The plasma moves in an accelerating manner under the action of the electric field force and the magnetic field force, formed cracks are further impacted, and crack expansion is achieved. Through control over the space-time position and the field energy of the electromagnetic field, the purpose of ultra-fast laser hidden cutting on the basis that the electromagnetic field controls the plasma to regulate and control crack expansion is achieved. According to the laser cutting device and method, the ultra-fast laser hidden cutting quality is kept and improved, and meanwhile the bottleneck problem about the low hidden cutting efficiency is solved.

Description

technical field [0001] The invention belongs to the field of mechanical cutting and processing, and relates to a high-definition ultrafast laser stealth cutting technology, in particular to a laser cutting device and method for controlling plasma to regulate crack expansion by an electromagnetic field. Background technique [0002] At present, the semiconductor industry widely uses mechanical dicing methods to cut wafers. Wafer mechanical dicing is the use of high-speed rotating cutting blades to directly divide the wafer. The advantage of mechanical cutting is that it is easy to operate and does not require high cutting equipment. However, mechanical cutting has many disadvantages. Firstly, mechanical dicing can easily cause chipping and breakage of the wafer; secondly, the scribing line of mechanical dicing is relatively large, causing unnecessary waste; finally, the blades used in mechanical dicing are easy to wear and need to be replaced frequently, resulting in high c...

AI Technical Summary

Problems solved by technology

However, as the demand for chips increases, the efficiency of laser stealth dicing cannot meet the relevant requirements. Therefore, improving the efficiency of laser stealth dicing is an urgent problem to be solved in the semiconductor industry

[0005] Generally speaking, the semiconductor industry improves the processing efficiency by increasing the laser energy to form a larger modified layer to reduce the number of stealth cuts, but this leads to the expansion of the damaged area inside the wafer

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