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Light-emitting diode package

A technology of light-emitting diodes and packages, which is applied in the field of light-emitting diode packages, can solve the problems of reduced housing reflectivity, reduced light efficiency, light obstruction, etc., to minimize solder balls, improve adhesion, and accurately arrange Effect

Active Publication Date: 2020-03-03
SEOUL SEMICONDUCTOR
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In the prior art, the housing is formed of white synthetic resin, so there is a problem that the reflectivity of the first pin and the second pin is lower than that of the housing, which may cause light emission from the LED package. The efficiency of the light decreases
[0007] Moreover, since the light emitting diode chip is electrically connected to the first pin and the second pin by wires, there is a possibility that the light emitted from the light emitting diode chip may be hindered by the wires.

Method used

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  • Light-emitting diode package
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Examples

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Embodiment Construction

[0046] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The embodiments described below are provided as examples in order to fully convey the idea of ​​the present invention to those skilled in the art. Therefore, the present invention is not limited to the Examples described below and can be embodied in other forms. In addition, in the drawings, the width, length, thickness, etc. of the constituent elements are exaggeratedly shown for convenience. Throughout the specification, the same reference numerals may denote the same constituent elements.

[0047] image 3 is a perspective view illustrating a light emitting diode package according to a first embodiment of the present invention. and, Figure 4 to Figure 6 are a plan view and a cross-sectional view illustrating a light emitting diode package according to a first embodiment of the present invention. at this time, Figure 5 is along Figure 4 The section v...

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Abstract

The present invention relates to a light-emitting diode package. A light-emitting diode package according to one embodiment of the present invention comprises: a light-emitting diode chip having a first electrode pad and a second electrode pad at a lower portion thereof; first and second leads that are respectively in electrical contact with first and second electrode pads of the light-emitting diode chip and are spaced apart from each other; and a housing formed to surround the first and second leads and having a cavity open at an upper portion thereof, wherein the first and second leads respectively have a first lead exposed surface and a second lead exposed surface on which a portion of each of the first and second leads is exposed on the bottom surface of the cavity of the housing, wherein the first and second lead exposed surfaces may be formed in a size and shape corresponding to the first and second electrode pads.

Description

technical field [0001] The present invention relates to a light emitting diode package, and in more detail relates to a light emitting diode package capable of improving light efficiency emitted from the light emitting diode package. Background technique [0002] A light emitting diode is an inorganic semiconductor element that emits light generated by recombination of electrons and holes. Recently, light emitting diodes are being used in various fields such as display devices, lamps for vehicles, and general lighting. Compared with existing light sources, light emitting diodes have the advantages of long life, low power consumption, and fast response. Due to this advantage, existing light sources are being rapidly replaced. [0003] figure 1 is a plan view illustrating a conventional light emitting diode package, figure 2 is along figure 1 The section view taken by the S-S' interception line. [0004] The existing light emitting diode package is arranged in a state w...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/62H01L33/48
CPCH01L33/62H01L33/48H01L25/167H01L33/486H01L33/38H01L33/483H01L33/20
Inventor 金志浩
Owner SEOUL SEMICONDUCTOR
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