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Method for automatically creating via hole in copper sheet of PCB

An automatic creation and via technology, which is applied in the direction of instruments, electrical digital data processing, electrical components, etc., can solve the problems of uneven drilling and low efficiency, so as to improve efficiency and signal integrity, improve work efficiency, and alleviate The effect of current pressure

Pending Publication Date: 2020-02-28
HUIZHOU KING BROTHER CIRCUIT TECH +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The current method of drilling ground holes is manual drilling, which is uneven and easy to ignore many positions that need to be drilled, and the efficiency is low, which needs to be improved

Method used

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  • Method for automatically creating via hole in copper sheet of PCB
  • Method for automatically creating via hole in copper sheet of PCB

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] This embodiment provides a method for automatically creating vias on the PCB copper skin, which is characterized in that: when the PCB is in the current window, when receiving external command information, it can automatically search and obtain the position information corresponding to the relevant command, And create and place ground vias as required in the instruction.

[0029] Further, the desired via hole can be arbitrarily selected in the current PCB, or a newly added one.

[0030] Further, the position information is automatically acquired on the current PCB network copper skin according to the currently set distances from vias to traces, pads and other network copper skin elements.

[0031] Further, the position information is calculated based on the ground copper laid on the current PCB as a reference.

[0032] Further, the creation of the location information of the ground vias includes the following steps:

[0033] S1. The file must be under the current PCB ...

Embodiment 2

[0039] This embodiment provides a method for automatically creating vias on the PCB copper skin, including the following steps:

[0040] Step 1. Under the current PCB interface, when receiving the command to automatically create ground vias, the distance information between all relevant elements on the current PCB and the ground copper network will be automatically obtained;

[0041] Step 2, the relevant elements of the PCB mainly refer to vias and traces, pads, and other network vias and copper skins; the automatically created vias need to keep a certain distance from these elements to avoid open and short circuits phenomenon, so it is necessary to manually set the distance between via holes and other elements and the distance between automatically placed hole arrays in the interface;

[0042] Step 3. After manually setting the distance from ground vias to traces, pads and related elements, the point will start to be created, and the program will automatically obtain the coor...

Embodiment 3

[0047]This embodiment provides a method for automatically creating vias on the copper skin of the PCB consistent with Embodiment 1, the difference is that the location information of the creation of ground vias includes the following steps:

[0048] Step 1: When receiving an external execution trigger, the program will check whether routkeepin / all is set in the outline of the board frame, and if so, proceed to the next step.

[0049] Step 2: The program will identify the size of the area where vias need to be placed according to the minimum coordinates x(0,0) and x(0,119), y(0,71) of the example board frame.

[0050] Step 3: The program will pop up as figure 2 In the user interface, you can select the size of the via hole to be placed in it, and set the distance between the via hole and the trace, the pad and the via copper skin of other networks. The default is 10mil; you also need to set the spacing of the via hole placement array. The program defaults to 100mil.

[0051]...

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Abstract

The invention provides a method for automatically creating a via hole on a copper sheet of a PCB (Printed Circuit Board), which is characterized in that the PCB can automatically search and acquire position information corresponding to a related instruction when receiving external instruction information under a current window, and create and place the via hole according to requirements in the instruction. According to the method, when an external trigger is received, via holes can be automatically created in a ground network copper sheet according to set intervals and arrays, careless omission caused by manually placing the via holes can be avoided, the working efficiency is improved, the conductive area can be increased, the current pressure of a bottleneck part can be relieved, the impedance of a circuit can be reduced, and the integrity of signals can be enhanced.

Description

technical field [0001] The invention belongs to the technical field of PCB processing, and in particular relates to a method for automatically creating a via hole on a PCB copper skin. Background technique [0002] At present, Allegro printed circuit board (Printed Circuit Board, PCB) design software is more and more favored by users. After using the design software to complete the layout and wiring of the PCB and laying copper, the user needs to punch some ground vias on the copper skin of the power supply. The main functions are as follows: it can increase the conductive area, relieve the current pressure of the bottleneck part of the circuit, and effectively Reduce the return path of the current; it can play the role of heat dissipation, especially if more holes are drilled under the heating device to increase the release of heat and buffer the deformation of the circuit board; it can play the role of electromagnetic radiation isolation, A space loop will be formed bet...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F30/392H05K3/00
CPCH05K3/0005
Inventor 石恒荣李享武守坤陈春
Owner HUIZHOU KING BROTHER CIRCUIT TECH
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