Semiconductor refrigeration assembly and refrigerator

A semiconductor and component technology, applied in the field of semiconductor refrigeration components and refrigerators, can solve the problem of low heat exchange efficiency

Inactive Publication Date: 2020-02-28
合肥美菱物联科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The embodiment of the present invention provides a semiconductor refrigeration assembly and a refrigerator to solve the problem of low heat exchange efficiency in the prior art

Method used

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  • Semiconductor refrigeration assembly and refrigerator
  • Semiconductor refrigeration assembly and refrigerator
  • Semiconductor refrigeration assembly and refrigerator

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] Such as figure 1 As shown, the embodiment of the present invention provides a semiconductor cooling assembly, please refer to figure 1 with figure 2 ,in figure 1 Exploded diagram for semiconductor refrigeration components, figure 2 It is a combination diagram of a semiconductor refrigeration assembly, wherein the semiconductor refrigeration assembly may include: a cold-end radiator 1, a cold-conducting block 2, a semiconductor refrigeration sheet 3, a plastic middle frame 4, and a hot-end radiator 5; wherein, the plastic middle Frame 4 is used to assemble the cold-end radiator 1, the cold-conducting block 2, the semiconductor cooling fin 3 and the hot-end radiator 5 together in order; the cold-end radiator 1 and the A thermal insulation layer 6 is also arranged between the hot end radiators 5, and the thickness of the thermal insulation layer 6 is the sum of the thicknesses of the cold conduction block 2 and the semiconductor refrigeration sheet 3;

[0036] One si...

Embodiment 2

[0051] The embodiment of the present invention also provides a refrigerator, please refer to Figure 8 with Figure 9 ,in Figure 8 shows the structure outside the rear wall of the refrigerator body, Figure 9 The structure inside the rear wall of the refrigerator body is shown, including: a refrigerator body 20 and a semiconductor refrigeration assembly 10 as described in any one of Embodiment 1; the semiconductor refrigeration assembly 10 is arranged on a target side wall of the refrigerator body 20 , and the semiconductor cooling assembly 10 is vertically arranged, the cold end radiator in the semiconductor cooling assembly 10 is located inside the side wall of the target, and the hot end radiator in the semiconductor cooling assembly 10 is located in the target outside the side wall;

[0052] The target side wall is formed with an air duct structure 101-103, the air duct is connected with the storage bin of the refrigerator body, the cold end radiator is located in the ...

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PUM

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Abstract

The invention provides a semiconductor refrigeration assembly and a refrigerator. The refrigerator comprises a refrigerator body and the semiconductor refrigeration assembly. The semiconductor refrigeration assembly is arranged on a target side wall of the refrigerator body. The semiconductor refrigeration assembly is arranged vertical. An air channel structure is formed in the inner wall on the back of the refrigerator body. An air channel communicates with a storage bin of the refrigerator body. A cold side radiator is located in the air channel. A cold side fan is further arranged in the air channel. According to the scheme of the semiconductor refrigeration assembly and the refrigerator, after a semiconductor chilling plate refrigerates, cold energy is transmitted to the cold side radiator through a cold conduction block; because the cold side radiator is used as a cold side evaporation device, and an aluminum liner is omitted, under the action of the cold side fan, cold energy evaporated by the cold side radiator carries out thermal exchange with air in the storage bin of the refrigerator through air convection, the thermal exchange efficiency can be improved, and by adoptingthe manner of air convection, articles in the storage bin can be cooled even, and refrigeration is quicker.

Description

technical field [0001] The invention relates to the technical field of refrigerators, in particular to a semiconductor refrigeration assembly and a refrigerator. Background technique [0002] At present, the direct cooling type is the mainstream in the market for mini refrigerators and mini heating and cooling boxes. The existing semiconductor refrigeration chip cooling method generally uses aluminum liner as the heat exchange device. The heat exchange principle is through the contact between the item and the inner wall of the storage compartment. , for direct conduction heat transfer. However, many items stored in the storage bin have irregular shapes, the contact area with the aluminum liner is also small, and the heat exchange efficiency is low. Contents of the invention [0003] Embodiments of the present invention provide a semiconductor refrigeration assembly and a refrigerator to solve the problem of low heat exchange efficiency in the prior art. [0004] In the f...

Claims

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Application Information

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IPC IPC(8): F25B21/02F25D11/00F25D17/06F25D21/14F25D23/00F25D23/06
CPCF25B21/02F25D11/00F25D17/062F25D21/14F25D23/003F25D23/06Y02B40/00
Inventor 张新星李昱兵高向军辛钧
Owner 合肥美菱物联科技有限公司
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