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Heat dissipation device of server case

A technology for cooling devices and servers, which is applied to instruments, electrical digital data processing, digital data processing components, etc., can solve the problem that the cooling fan cannot meet the cooling effect, etc., to improve the water cooling effect, ensure the running speed and speed up the cooling speed. Effect

Inactive Publication Date: 2020-02-21
INSPUR SUZHOU INTELLIGENT TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention aims at the above-mentioned deficiencies existing in the prior art, and provides a heat dissipation device for a server case, which solves the problem that the cooling fan inside the server case alone cannot meet the heat dissipation effect.

Method used

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  • Heat dissipation device of server case
  • Heat dissipation device of server case
  • Heat dissipation device of server case

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Embodiment Construction

[0030] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0031] Such as figure 1 As shown, a cooling device for a server case includes a cooling box 1, a heat conduction device 2, a lifting mechanism 3 and an exhaust device 5. The upper end of the cooling box 1 is provided with a placement port 105 for placing the server box 4 in the cooling box. 1, a partition 102 is arranged horizontally in the cooling box 1, the air cooling chamber 103 is above the partition 102, the water cooling chamber 101 is below the partiti...

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Abstract

The invention discloses a heat dissipation device of a server case. The device comprises a cooling box, a heat conduction device, a lifting mechanism and an exhaust device. A placing opening is formedin the upper end of the cooling box. A partition plate is transversely arranged in the cooling box. An air cooling chamber is arranged above the partition plate. A water cooling chamber is arranged below the partition plate, a heat conduction device used for containing a server case is connected above the partition plate, the heat conduction device is connected with the water cooling chamber, a lifting mechanism used for fixing the server case is arranged on one side of the heat conduction device, and an exhaust device used for exhausting heat is arranged on the other side of the heat conduction device. Air circulation on the outer side of the server case is accelerated through the air exhaust device. Heat dissipation of the server case is achieved through fast flowing cold air. Meanwhile, the water cooling chamber at the bottom further reduces the temperature in the server case and the air cooling chamber through the heat conduction device, the heat dissipation speed is increased, and the problem that at present, the heat dissipation effect cannot be achieved only through a heat dissipation fan in the server case is solved.

Description

technical field [0001] The invention relates to the technical field of server heat dissipation, in particular to a heat dissipation device for a server chassis. Background technique [0002] A server, also called a server, is a device that provides computing services. Since the server needs to respond to and process service requests, generally speaking, the server should have the ability to undertake and guarantee services. The composition of the server includes processors, hard disks, memory, system buses, etc., which are similar to general computer architectures, but due to It needs to provide highly reliable services, so it has high requirements in terms of processing power, stability, reliability, security, scalability, and manageability. [0003] When the server is running, its internal components will generate a lot of heat, which will affect the running speed of the server and accelerate the aging of the components. Therefore, it is necessary to continuously dissipat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20
CPCG06F1/20
Inventor 朱箫鸣
Owner INSPUR SUZHOU INTELLIGENT TECH CO LTD
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