Character processing method of PCB ultra-thick copper plate

Abstract

The invention discloses a character processing method of a PCB ultra-thick copper plate. When character printing is performed on a single side of a PCB and a character spans a substrate surface and acopper surface, the method comprises the following steps of performing character ink-jet on the substrate surface, where the character is to be printed, on a production plate; using a silk screen to perform silk printing on a character on the copper surface on the production plate, wherein the silk screen comprises a copper surface region and a substrate region, the substrate region corresponds tothe substrate surface on the production plate, the copper surface region corresponds to the copper surface on the production plate, and the silk screen is provided with an image-text mesh hole only at the corresponding character of the copper surface region; and baking the production plate so that ink subjected to silk printing on the production plate can be cured. According to the method, the problems that the characters on the PCB ultra-thick copper plate are not inked and distinct can be avoided, it is ensured that the produced characters cannot fall off due to friction, and distinction and attraction of the characters can be guaranteed.

Description

technical field [0001] The invention relates to the technical field of printed circuit board production, in particular to a character processing method for a PCB ultra-thick thick copper plate. Background technique [0002] According to different application requirements, in order to meet the needs of large current passage and rapid heat dissipation, the copper layer thickness (copper surface thickness) of the outer layer line must reach ≥180 μm. This type of PCB substrate is called PCB ultra-thick copper board. [0003] The existing PCB character production process is generally to make the solder mask layer first, and then make characters in the specified area, which specifically includes the following methods: substrate after solder mask development → inkjet A-side characters → inkjet B-side Characters → post-curing → post-process processing; substrate after solder mask development → silk screen A-side characters → silk screen B-side characters → post-curing → post-process...

AI Technical Summary

Problems solved by technology

[0004] In the production process of PCB ultra-thick copper plate, due to the large height difference between the copper surface and the substrate surface (the step height difference is large), according to the above-mentioned one-time screen printing character production method or secondary screen printing character production method When silk-screening character inks on PCB ultra-thick copper boards, ink cannot be printed at the junction of the line (copper surface) and the line (copper surface) or the copper surface and the substrate surface, resulting in unclear characters; Although the advanced character inkjet machine can solve the problem that these height drop characters cannot be printed with ink, but because of the characteristics of inkjet inks on the market, there are still factors of insufficient adhesion and toughness, because the quality of this type of substrate is generally low. It is heavy, and the characters on the protruding position are prone to rubbing and falling off, resulting in complaints from customers because the characters made fall off